The Eye on Intelligence Challenge

Table of contents

design challenge header

Keep an eye on FPGA Machine Learning with this AI-Powered Challenge

More developers today are designing embedded vision systems into their projects. As such, embedded vision is having a transformative effect on skill sets, technical innovation, and product development. AMD adaptive SoCs and FPGAs are ideal devices for designing embedded visual intelligence. This competition is an opportunity for you to hone your embedded vision skills, utilizing a development kit based on the AMD Zynq-7000Tm SoC devices.

Participants will design and build an embedded vision project of their choice. Twenty official applicants will receive free-of-charge a Digilent Arty Z7 (P/N 410-346-20), a development platform designed around the Zynq-7000Tm SoC from AMD. For a chance to win one of the great prizes in this challenge, you must blog about your design process, as well as the final-result of your Embedded Vision Project. The Sponsor’s kit must be used in your final project. Creative use of the FPGA components and interesting uses of AMD’s adaptive SoC technology are key to winning this competition.

Example tasks that can be performed include but are not limited to:

  • Facial Recognition Signage
  • ANPR Registration Plate Monitoring System
  • Object Classification
  • Object Sorting System

Who Can Join?

Any element14 member. Click here to read the FAQs. You need to submit an application entry form by the enrollment due date (see Timeline Table). If you are not an element14 Community member, please join here.

The Prizes

Prize Prize Category

Grand Prize Winner

Grand Prize

Approximate Value $911 USD*

  • MULTICOMP PRO MP720025 Digital Oscilloscope
  • MULTICOMP PRO MP710082 Bench Power Supply

Runner Up

Runner Up

Approximate Value $380 USD*

  • MULTICOMP PRO MP720857 Handheld Oscilloscope
  • TENMA 72-2660 Handheld DC Power supply

Finisher Prize**

Finisher prize
To be a finisher you must complete a final project blog that details the testing you have performed.

Approximate Value $54 USD*

  • MULTICOMP PRO MP781004 Handheld Digital Multimeter
*Or local equivalent
**Grand Prize and Runner Up winners do not earn the finisher prize.

The Kit

A maximum of 15 FREE kits will be offered depending on qualified applicants. To be eligible to receive a kit, you must submit an application by the enrollment deadline (See to Timeline Table).

Product Description
Arty Z7: Zynq-7000Tm SoC Development Board Buy now

Note: The challenge kit does not provide everything that will be needed for this competition. The challenger will need to have the resources and equipment, as well as other minor parts to build their Embedded Vision projects.

The Dates

Project Phases Dates
Application Period 17th June 2024
Application Deadline 2nd August, 2024
Applicants Selected 9th August, 2024
Extra Credit Blogs Due 30th October, 2024
Final Summary Blog Due 4th November, 2024
Winners Announced November, 2024
Prizes Shipped November, 2024

Technical Resources

Blog Requirements, FAQs, & Judging

The final, detailed, summary blog is the only requirement to successfully finish this program. However, a participant can earn extra points by publishing up to 5 extra credit blogs. Click the following link to read how these 5 blogs will be individually scored. More Information.

The Challengers

track your progress and see how you compare to other participants via the following table:

Final Results Blog Extra Credit
Blog 1
Extra Credit
Blog 2
Extra Credit
Blog 3
Extra Credit
Blog 4
Extra Credit
Blog 5
Total Points
Name - Project
0 0 0 0 0 0 0

Where to Ask Questions?

For any general or technical questions about the competition, please post a comment on this page. It is monitored by element14.

Bookmarking this page is a good way to keep up-to-date with the competition.

The Terms

Please read the full terms and conditions attached below.

About Sponsor

AMD is the inventor of the FPGA, hardware programmable SoCs, and the adaptive compute acceleration platform (ACAP). Learn more about their technologies that enable rapid innovation from the endpoint to the edge to the cloud.

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