<?xml-stylesheet type="text/xsl" href="https://community.element14.com/cfs-file/__key/system/syndication/rss.xsl" media="screen"?><rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:slash="http://purl.org/rss/1.0/modules/slash/" xmlns:wfw="http://wellformedweb.org/CommentAPI/"><channel><title>IPC-9708 evaluates printed-board assembly materials</title><link>/members-area/personalblogs/b/blog/posts/ipc-9708-evaluates-printed-board-assembly-materials</link><description>Specifications allow product developers to avoid the problems of pad cratering. http://www.interconnectionworld.com/index/display/article-display/4121864582/articles/connector-specifier/design-test/printed-circuit-board/2011/3/IPC-9708-evaluates...</description><dc:language>en-US</dc:language><generator>Telligent Community 12</generator></channel></rss>