I hope Eagle will take my criticism hear constructively.
First, I know and use several EDA programs. Each has its odd
characteristics, none is perfect.
I come back to Eagle every year or so because it has such promise and the
program I now use is starting to show frayed edges (Circuit Maker 2000 pro)
which is a Protel layout basically.
About release 4.0 or so, I sent an email to Eagle asking if they would ever
incorporate the ability to manipulate individual pads on a package while on
a board. They said they would but as far as I can see, never did.
If you have ever used this option and most of my EDAs have it, you'll
realize how handy it is. For instance in Circuit Maker and Electronics
Workbench I can change the size and location of any pad on any package while
it is on a board. If I have two pins on a DIP that don't have wires attached
I can change the size of the pads to give more clearance for wires passing
through the DIP.
I can do the same thing on a connector block or a simple three lead
Hopefully this has been incorporated in Eagle, although I can't find any way
to do it in the help. If it has pass me a note and I'll reevaluate the
program. If not I'll look at it again next year.