I will use a stencil to apply solder paste to the pcb in order to assembly the board using a reflow oven. For SMD components, the tCream and bCream are generated, so these files can be used to generate the stencil.
Now, since I have few Through Hole parts, I would like to solder them also using the reflow oven (process also known as Pin In Paste) to avoid soldering by hand. My question is how can I add the through hole components to the tCream layer? (by default, tCream is only generated for SMD pads, no TH)
Thanks in advance.