https://community.element14.com/products/manufacturers/ams_osram/en-USTelligent Community 12https://community.element14.com/products/manufacturers/ams_osram/b/blog/posts/ir-led-product-versions-based-on-the-new-ir-6-technology-to-boost-performance-in-security-and-biometrics-applicationsFri, 13 Dec 2024 08:53:00 GMT93d5dcb4-84c2-446f-b2cb-99731719e767:688af84d-f616-40ce-8fd3-234a1c2f84c2CorinnaR.The new IR:6 thin-film chip technology will enable manufacturers of products such as security cameras and biometric authentication systems in PCs and smart doorbells to achieve better illumination for improved image quality as well as the faster, more accurate recognition of individual biometric markers, while saving power and extending battery run-time between charges. In medical equipment such as light therapy fixtures for the treatment of tissue damage, the higher optical power output from the IR:6 chip will enable equipment manufacturers to use fewer LEDs while producing the same therapeutic effect, saving space and reducing bill-of-materials cost. The first ams OSRAM products to take advantage of the new chip are the OSLON® P1616 series of high-power LEDs in a compact 1.6mm x 1.6mm package — and the OSLON® Black family, which offers various viewing angle options, including a new rectangular field of illumination which is perfect for use with IR cameras. Dominic Bergmann, Product Marketing Manager at ams OSRAM, emphasized: ”The new, improved IR:6 technology is raising IR LEDs from ams OSRAM to the top rank in their market segment for brightness and efficiency. Customers that replace their existing IR LEDs with new IR:6-based LEDs can instantly achieve better performance in their application with lower power consumption.” IR:6: the next generation of infrared LED technology The new IR:6 chip technology implements various improvements in materials, structure and design to achieve its superior performance. These improvements include: Improvements to the intrinsic chip efficiency A new central bond pad for better current spreading and a lower forward voltage Better roughening of the chip’s surface for higher decoupling efficiency and higher brightness In addition, the new IR:6 technology adds the capability to emit light at a 920nm dominant wavelength, as well as the familiar 850nm and 940nm wavelengths. The new 920nm option offers a higher signal-to-noise ratio (SNR) than the 940nm option because of photodiodes’ higher sensitivity to shorter wavelengths, and a weaker visible red glow effect than at 850nm. At the time of its launch, the IR:6 technology is available in the following ‘B’ designated versions of the existing OSLON® P1616 products, which are aimed at space-constrained applications: OSLON® P1616 SFH 4180BS – 920nm/940nm wavelength options, 1485mW radiant flux, 130° viewing angle OSLON® P1616 SFH 4181BS – 920nm/940nm wavelength options, 1550mW radiant flux, 70° viewing angle OSLON® P1616 SFH 4182BS – 920nm/940nm wavelength options, 1650mW radiant flux, 130° optimized viewing angle The technology is also available in new versions of existing OSLON® Black emitters: OSLON® Black SFH 4713B – 850nm wavelength, 980mW radiant flux, 80° viewing angle OSLON® Black SFH 4714B – 850nm wavelength, 940mW radiant flux, 150° viewing angle OSLON® Black SFH 47167B – 850nm wavelength, 940mW radiant flux, 110° x 130° rectangular field-of-illumination The IR:6 chip is manufactured by ams OSRAM at its plant in Regensburg, Germany. The entire supply chain for OSLON® P1616 and OSLON® Black LEDs, from chip to packaging, is fully controlled by ams OSRAM to give customers full confidence in the product’s high-volume availability. Further information on the IR:6 technology can be found on our homepage. Learn more in the latest whitepaper, click here to download for free: IR LED IR:6 | ams OSRAM The IR:6 technology is e.g. used in biometric authentication systems in PCs The IR:6 technology is also used in Closed-Circuit Television (CCTV) applicationschip technologyledams osramhttps://community.element14.com/products/manufacturers/ams_osram/b/blog/posts/leveraging-multispectral-sensing-to-reduce-food-waste-ams-osram-s-photonic-innovationTue, 03 Dec 2024 09:59:00 GMT93d5dcb4-84c2-446f-b2cb-99731719e767:e85719e4-937d-4971-be9f-43e397fb4501CorinnaR.Food waste is a pressing global challenge that affects both the environment and the economy. Recent figures show that up to one-third of the food produced globally is lost or wasted, leading to unnecessary resource consumption, greenhouse gas emissions, and financial losses. ams OSRAM, a global leader in intelligent sensors and emitters, is committed to providing cutting-edge sensor technologies that address these issues head-on. The company’s multispectral sensing solutions are driving meaningful change in the agricultural and food industries by pinpointing ideal harvest times, ensuring better quality control and reducing waste throughout the supply chain. At the Photonics Days Jena 2024, ams OSRAM presented the latest advancements in multispectral sensing technology, showcasing how its solutions are helping to transform food production and management. By delivering precise, real-time data on the ripeness and quality of fruit, the company empowers industries to make informed, sustainable decisions that benefit both businesses and the planet. Tackling food waste with multispectral technology Food loss and waste contribute significantly to the world’s environmental footprint, including 4.4% of global greenhouse gas emissions. By addressing inefficiencies in harvesting, post-harvest handling, and distribution, ams OSRAM can help to significantly reduce waste. Its multispectral sensing technology offers a powerful solution by identifying the optimal time for harvesting and managing food quality during storage and transportation. The company’s multispectral sensors operate by analyzing the molecular composition of fruit through the reflectance of light at specific wavelengths. These non-invasive sensors track critical molecular changes, such as the breakdown of chlorophyll or the accumulation of carotenoids, providing an accurate and detailed picture of the ripening process. The science: spectral insights into ripening ams OSRAM’s multispectral sensors leverage the visible (VIS), near-infrared (NIR), and shortwave infrared (SWIR) spectra to monitor key pigments and molecules such as chlorophyll, anthocyanins, carotenoids, water, and carbon-hydrogen bonds. As fruits ripen, these molecular components evolve, which can be precisely measured using the company’s sensors. In a comprehensive 18-week study, researchers from ams OSRAM examined the ripening process in Gala apples, tomatoes, and bananas. Using spectroscopic data, they identified clear markers at key wavelengths that indicate the optimal harvest time and ongoing ripeness: Chlorophyll (670 nm): Reflectance decreases as the fruit ripens, signaling the degradation of chlorophyll. Anthocyanins (550 nm): These pigments, which give fruit its red and purple hues, become more pronounced as the fruit ripens. Carotenoids (480 nm): Responsible for yellow and orange colors, carotenoids increase toward full ripeness. Water and starch (970–1190 nm): These bands provide insights into internal changes like water loss and starch conversion, critical for monitoring fruit quality during storage. By tracking these wavelengths, sensors from ams OSRAM offer outstanding accuracy in determining the ripeness of various fruits, helping producers harvest at the perfect time to maintain quality and reduce losses. Practical applications: from field to consumer The AS7341 multispectral sensor is at the core of these innovations. This compact, cost-effective solution captures real-time data across eight visible (VIS) channels and one near-infrared (NIR) channel, making it a versatile tool for a wide array of industries. With its advanced multispectral sensing technology, the AS7341 delivers actionable insights at every stage of the food supply chain. These include: Agriculture: Smart harvesting systems can determine the ideal time for picking fruit, minimizing the risk of over-ripening in the field and reducing food loss during transport. Processing and sorting: Automated sorting systems can categorize fruits based on internal quality rather than appearance, improving efficiency and cutting waste in processing plants. Retail and distribution: Supermarkets and distribution centers can monitor produce freshness in real time, ensuring that only the highest-quality products reach the shelves. Consumer devices: Handheld devices equipped with multispectral sensors could soon help consumers select perfectly ripe fruit, reducing household food waste. The potential for multispectral sensing technology in the food industry is immense. With the ability to reduce waste, improve product quality, and extend shelf life, ams OSRAM’s sensor solutions offer a scalable, cost-effective tool for farmers, food processors, and retailers alike. By integrating these sensors into their operations, businesses can streamline workflows, enhance quality control, and make significant contributions to global sustainability efforts. Looking ahead: shaping a sustainable future The multispectral sensing research presented at the Photonics Days Jena 2024 highlights the transformative power of photonics in the fight against food waste. ams OSRAM’s innovative sensor technologies are not only helping businesses operate more efficiently but also driving the future of sustainable food production. By enabling real-time, data-driven decision-making, the company is contributing to a more sustainable food system for future generations. Our vision is clear: to harness the power of light for a smarter, more sustainable world. As the demand for efficient, eco-friendly solutions grows, ams OSRAM remains at the forefront of innovation, creating products that deliver tangible benefits across industries. Together, we can reduce food waste, improve quality, and pave the way for a brighter, more sustainable future.environmentmultispectral sensorams osramsensorhttps://community.element14.com/products/manufacturers/ams_osram/b/blog/posts/how-ingenuity-and-expertise-led-to-the-development-of-our-multi-pixel-ledMon, 25 Nov 2024 13:14:00 GMT93d5dcb4-84c2-446f-b2cb-99731719e767:adfc8891-8b4a-4b4d-a9bf-8c3253cd59c3CorinnaR.A stunning performance breakthrough in car headlamps The origin of a technology breakthrough often lies not in a scientific or engineering insight, but in a vision, an imagined future. For a specialist team of our engineers in the early 2010s, the spark for their imagination came from a discussion with a customer. Their wild idea? A pixelated LED light source. At the time, an LED was a simple chip producing one homogeneous light beam – that is, a single ‘pixel’. What our engineers were thinking of was a truly futuristic idea for a beam made up of hundreds or thousands of individual beams. Applied in headlights, this idea had the potential to give light a new meaning: a beam that can adapt dynamically to changing conditions outside the car, and as well, a beam that can convey messages. Soon, the potential value of this idea for industry and for the end consumer became so appealing that a small but dedicated development group was set up, drawing on participants from across the whole value chain, from the LED manufacturer, to a headlamp manufacturer and a car OEM. This pioneering vision led eventually to the introduction in 2023 of ams OSRAM’s EVIYOS® technology. The EVIYOS® LED is a multi-pixel light source for car headlamps which can project pictures on the road, and selectively dim sections of the high beam to avoid dazzling other road users while illuminating much more of the driver’s field of view than a conventional low-beam headlamp does. The harder the problem, the more inventive the solution The scale of the technological hurdles that had to be overcome was enormous. When the work started, a single LED was a chip with a typical light-emitting area of up to 1mm x 1mm. The dimensions were far too large to fit the concept of a ‘multi-pixel’ headlamp. But the problem did not stop with the need for smaller LED light sources: a multi-pixel headlamp would also require new electronics for controlling the beam, and new packaging and manufacturing technologies for making the system. It was almost impossible to imagine how such a product could be made. The seed, however, had been planted. In fact, the sheer apparent impossibility of the problem forced the engineers to consider solutions that normally might have been rejected out of hand as being too extreme or risky or unlikely to succeed. The development work started with a 4-pixel LED as a proof-of-concept. But this did not reflect our team’s vision: their idea was to make a headlamp which contained thousands of pixels. There was a huge gulf between the four pixels in the proof-of-concept, and the multi-pixel headlamp that the team had in mind. How could it justify the enormous development effort and risk required to bridge the gap between four and thousands of pixels? In fact, market demand was beginning to move in the team’s favor. The first adaptive driving beam (ADB) headlamps with 20 mm x 1mm chips on the OSRAM OSTAR headlamp platform were coming on the road, starting in a luxury car and extend to compact cars thanks to the improved safety they offered for night time driving. But it was obvious that those ADB solutions with single LED chips would reach a physical limit at around 100 chips. To realize the original team’s vision, tens of thousands of pixels were needed: to fill the gap, it was clear a completely new technology was needed. From idea to reality: a team effort This moment brought an offer from the German government for a publicly funded project. This gave the opportunity to form a consortium of industrial and scientific contributors: Daimler, the car OEM, which could define the system requirements and provide the application environment for testing and validating the headlamp Hella for designing and assembling the lamp OSRAM* for the LED, and for integration of the LED with an IC and associated electronics Infineon, to make an LED driver capable of controlling multiple LED ‘pixels’ Fraunhofer for technology system integration As the µAFS (Micro Advanced Frontlighting System) project team, the engineers from these companies worked from 2013 to 2016. OSRAM, developing the opto-semiconductor technology, encountered many problems in realizing its ambitious microLED concept, including: Producing sufficient optical power output (brightness) from the LED Crosstalk at the LED and phosphor layer, causing light to leak between LED pixels Difficulty in maintaining color consistency across the microLED array Nevertheless, the teams found solutions, and in 2016 revealed the fruit of their labor: a 1,024-pixel microLED headlamp concept that was able to individually control each pixel. This was an astonishing feat of engineering, producing far smaller LED point light sources than had ever been made before. In fact, this demonstration design contained 10 times more LED pixels than any existing technology could support, which led to the development of the EVIYOS® 1.0. Now OSRAM, ever the pioneer in lighting , committed to transforming the concept from an idea to a proof-of-concept towards product development. It was the kind of engineering challenge that excites the people at ams OSRAM: at every level from senior management to the development engineering team, people could see the potential in multi-pixel LED headlamps to make road travel safer, more comfortable, and more enjoyable. Through the magic of light, OSRAM could transform the night-time driving experience. Hopes of success are dashed The moment of revelation – the release of the EVIYOS® 1.0 – was, however, both a triumph and a crushing disappointment. To make a real headlamp from this pixelated LED, headlamp makers would require as many as five of the multi-pixel LEDs, each with its own optics. It became clear that this would be too cumbersome and expensive to manufacture. Despite all the valuable engineering breakthroughs that the OSRAM team had made, their proof-of-concept was not the basis of a commercially viable product. It was back to the drawing board for the team. And the task was now even harder, because the car industry had decided that its idea of dynamic forward lighting included the ability to project pictograms (such as safety warning or information messages) on to the road. This would require even more pixels. Despite the µAFS disappointment the OSRAM team never lost hope. In fact, they were in 2018 buoyed by the news that two large competitors in the LED market had learned from the papers published by the µAFS project team, and were now busy attempting to develop their own automotive microLED projectors. The race was on! So now, two years after finishing the µAFS consortium it was decision time for OSRAM: it faced the choice of walking away, or doubling down on its investment in the technology. OSRAM had always been a leader in the technology of light. It had a famous history of innovations in automotive lighting. Breakthroughs in opto semiconductor technology had always required courage and perseverance, and the multi-pixel LED was no different. So OSRAM committed itself to the technology: with a substantially larger team, drawing in experts from multiple disciplines, now started work on developing a commercially viable product. After becoming ams OSRAM as the result of the merger between OSRAM and analog semiconductor manufacturer ams, the team also benefited from the Austrian company’s in-house IC design and manufacturing expertise. The EVIYOS LED finds a ready market It took another five years of relentless research and development to produce the new EVIYOS® LED . By 2023, ams OSRAM was ready to launch the EVIYOS® product: a 25,600-pixel LED in a single package with a fully integrated driver IC which individually controls every single pixel. The EVIYOS® LED fully realizes the original vision for multi-pixel LED technology: the beam can be precisely controlled to cut off the beam where it would dazzle the occupants of oncoming vehicles or pedestrians by the side of the road, while providing a large, bright field of illumination to light the road ahead even better than a conventional high beam does. It can also project in high resolution pictograms and text on to the surface of the road ahead, providing a new capability to provide safety signals and useful information to the driver, as well as to convey branded ‘welcome’, ‘coming home’ and other messages to the car’s users. www.youtube.com/watch And the EVIYOS® LED is a commercially viable product, with the first headlight product recently announced. The vision has finally been realized. Like all technology breakthroughs, the EVIYOS® project subjected its engineers to their fair share of disappointing setbacks as well as joyful triumphs. Its story shows that you have to have stamina to walk through the valleys of disappointment before you reach the heights of fulfilment. The EVIYOS® project is a clear example of the long-term commitment, strategic thinking and perseverance needed at all levels for a company to be a true innovator. From senior management to the engineering team, it takes commitment and engagement to succeed, and trust to persevere in the face of setbacks. This is the path which ams OSRAM has been on, and which it continues to follow. Please also sign up for our webinar: Webinar: EVIYOS® 2.0 - New era in road safety | ams OSRAM (ams-osram.com)ledams osramhttps://community.element14.com/products/manufacturers/ams_osram/f/forum/55042/as7421-problem-with-smux-and-gain-configuration/225220Sun, 10 Nov 2024 09:04:00 GMT93d5dcb4-84c2-446f-b2cb-99731719e767:bfe1bf27-c9a3-46ad-8031-e4cc9dd58fccAkropolidisHello, I'm working on a sensor library for the AS7421 as well to use for a project and I was just wondering how you decided on the configuration ( {0x21,0x21,0x21,0x21,0x43,0x43,0x43,0x43}) for the ram registershttps://community.element14.com/products/manufacturers/ams_osram/b/blog/posts/ams-osram-and-dominant-opto-technologies-to-enable-smart-automotive-ambient-lighting-with-intelligent-rgb-leds-leveraging-open-system-protocolFri, 08 Nov 2024 08:57:00 GMT93d5dcb4-84c2-446f-b2cb-99731719e767:abc66444-b448-4e83-a2b0-ec2fb44b3f22CorinnaR.The Open System Protocol (OSP) is a simple, open network technology for connecting LEDs, sensors, actuators and other devices in a car. Developed by ams OSRAM, the OSP is available for use completely free, with no license or royalties, by any manufacturer of LEDs or other devices. It’s particularly suitable for connecting hundreds of low- or mid-power LEDs in a dynamic lighting system, an increasingly popular option for automotive interior ambient and exterior lighting. www.youtube.com/watch Make interior vehicle lighting easier with a Stand-Alone Intelligent Driver (SAID) The world’s first OSP-compatible LED was the OSIRE® E3731i , an intelligent RGB LED with integrated driver. Now ams OSRAM has introduced a stand-alone OSP LED driver which enables any other low- or mid-power LED to behave as though it were directly connected to an OSP network. This means that manufacturers of automotive lighting systems can build OSP lighting networks without needing to use LEDs that have OSP connectivity built-in – and without the need for a local microcontroller to provide the OSP functionality. By avoiding the need to add local microcontrollers, this new stand-alone driver makes it easier to implement over-the-air (OTA) firmware updates – an important feature of new software-defined vehicle architectures. The new driver, the AS1163 , is known as a Stand-Alone Intelligent Driver (SAID) . It has nine output drivers, so a single SAID chip can drive three RGB LED channels. The chip’s intelligence is in its OSP networking capability. The driver implements commands for dynamic lighting effects transmitted over the OSP network from the host controller – the driver can adjust brightness at 16-bit resolution (equivalent dynamic range), 15-bit resolution (PWM 500Hz), or 14-bit resolution (PWM 1000Hz).AS1163 drivers can operate alongside OSIRE® E3731i LEDs in the same application. The SAID enables more flexibility But as well as driving RGB or single-color/white LEDs (both toplookers and sidelookers), each SAID device can also provide a bridge to the OSP network for any component, such as a sensor or actuator, that has an I2C interface. So now automotive manufacturers can build a complete OSP network with just a single host microcontroller, and with multiple SAID devices providing OSP connectivity for any low- or mid-power LEDs, and any I2C devices such as sensors, actuators or memories. An OSP network (which is compatible with a physical CAN bus) can connect up to 1,000 nodes at a maximum data rate of 2.4 Mbps in a two-wire daisy-chain configuration. The AS1163 is ideal for automotive interior lighting systems , which are typically assembled as long thin strips of LEDs: it is supplied in a slim 16-lead QFN package with a 3 mm x 3 mm footprint, ideal for instance in a lightbar assembled on a single-layer PCB. It has adjustable output current options from 1.5 mA to 48 mA (CH0) or 24 mA (CH1, CH2) per driver for low-power LEDs. Output clustering enables it to provide a single output of up to 288 mA for a mid-power LED. This means that the AS1163 can support automotive exterior as well as interior lighting applications. Automotive lighting designers can evaluate the AS1163 intelligent driver with the SAID Demonstrator Board, available via all authorized ams OSRAM sales channels from June 2024.ledams osramsensorhttps://community.element14.com/products/manufacturers/ams_osram/b/blog/posts/the-invisible-guard---direct-time-of-flight-sensor-technologyTue, 29 Oct 2024 07:26:00 GMT93d5dcb4-84c2-446f-b2cb-99731719e767:e0c8d211-6507-4136-82b0-0a9eaddb3784CorinnaR.You certainly know this from your everyday life: to unlock your cell phone, you now use your face, you look briefly at your gadget and the system recognizes you. The same authentication procedure is used on some laptops - you look briefly at the camera and you're in and ready to work. The authentication procedures require a great deal of precision, but at the same time they must not devour a lot of energy, because you also know from your experience how quickly a battery can run down. This makes the so-called time-of-flight sensing technology, which makes such applications possible, all the more important. Low-power time-of-flight sensing technology from ams OSRAM enables host systems to measure distances accurately and at exceedingly high speed. Accurate distance measurements are used in various applications including presence detection, human facial recognition and advanced cameras. To find out exactly how this all works and what other use cases are possible with time-of-flight, I invite you to listen to the Photon Studio episode "The invisible guard - direct time of flight sensor technology" Click below to tune in! Episode #5 - The invisible guard. Direct Time of Flight sensor technology with David Smith von The Photon Studio. The ams OSRAM Podcast (soundcloud.com)dToFroboticsdirect time-of-flightams osramsensorhttps://community.element14.com/products/manufacturers/ams_osram/b/blog/posts/in-plane-sensing-in-microled-displays---a-new-performance-and-manufacturing-paradigm-for-optical-sensing-in-consumer-and-automotive-electronic-devicesMon, 21 Oct 2024 11:47:00 GMT93d5dcb4-84c2-446f-b2cb-99731719e767:b6b1721d-1efa-4bf2-9da1-cd95dceab939CorinnaR.MicroLEDs are expected to bring about a step-change in the characteristics of displays deployed in the consumer and automotive electronics industries because of their valuable optical characteristics: they provide a much brighter, clearer image with much higher color accuracy as well as outstanding readability in bright sunlight. MicroLEDs are also very energy efficient. These properties make them attractive components for displays in products ranging from small, super-high resolution AR/VR headsets , to watches, phones, laptops, tablets, and displays in cars. MicroLEDs can even be used in large displays such as TVs and monitors. There is another aspect of microLEDs that offers the potential to produce a great improvement in display performance and to transform the entire display functionality: they enable sensor functionality to be integrated in the same pixel plane as the RGB emitters. This is made possible by the microLED’s minuscule dimensions, and offers valuable benefits including: Making sensors invisible Improving their sensitivity Enabling new functionality So what are the potential uses for in-plane integration of sensing and optical emission? And what steps have to be taken to realize the potential? Challenges of existing OLED display sensor implementations Traditionally, front-facing sensors in mobile devices perform functions such as display brightness control, white balancing and face authentication. These sensors have often been integrated in cut-outs in the display (bezels). The trend toward bezel-less displays means sensor manufacturers have developed sensors that can be integrated behind the display. In OLED displays and “behind OLED” sensing, an area where ams OSRAM is a technology pioneer, the sensors must be placed behind a display plane densely populated with OLEDs. This behind OLED sensing technology presents some implementation challenges due to the need for tight synchronization between the display system and the sensor system to avoid interference between the OLEDs and the sensors. The BOLED sensors must offer very high sensitivity to provide sufficient optical signal strength when operating behind an OLED display that has very low transmissivity (typically less than 10%). Also stacking a system with separate planes – one for the display, another for sensing – increases the overall height of the sensing display. Beyond miniaturization - opening up space on the display board for the integration of sensors in the plane MicroLEDs, the next technological advance, offer an exciting combination of very small dimensions and very high brightness. To date, there is no industry-standard specification for the mechanical features of a microLED: while some manufacturers have classed devices with sides as long as 50µm as ‘microLEDs’, ams OSRAM believes such devices are too large to have a disruptive market effect. Instead, the company is using its miniaturization expertise to create chip edge lengths of 10µm and less. At this size, a microLED is so small that it is not visible to the naked eye. In fact, RGB microLEDs are so small and can be driven at such high current that they can be widely spaced while still maintaining a very high-resolution output and high brightness. Display engineers refer to this as a low ‘fill factor’ – the ratio of total microLED area to total pixel area. A low fill factor means that there is free area around the microLEDs. While these areas are imperceptible to the human eye, they are large enough to accommodate sensor components such as micro-photodiodes (microPDs) and near infrared (NIR) microLEDs (see Figure 1). These are key components for optical sensors, where the microPDs either measure the incident light or the invisible light that was emitted by the NIR microLED and reflected by an object such as a finger touching the surface of the display. Fig. 1: the small size of microLEDs opens up space for sensors on a display’s emitter board New and improved sensor functions Aside from making the sensor elements practically invisible and removing the need for the stacking of display and sensors, there is another strong advantage to the in-plane display sensing architecture that microLEDs enable. By placing the sensor components in the same plane as the RGB microLED, they gain an unimpeded line of sight through the cover glass. This can simplify the implementation of sensors that are already found in OLED displays. Additionally, the pixelation of the optical sensor function in a microLED display (see Figure 2) enables new use cases and sensors. A microLED sensing display could enable new and improved sensor functions such as: Display local brightness control, where the ambient light sensing is distributed over the full display Camera and display white balancing Proximity sensing Vital signs monitoring Fingerprint recognition, which eliminates sub-systems such as ultrasonic sensing used for fingerprint recognition in today’s mobile phones. This could increase the fingerprint sensing area and reduce the height of the total sensing/display stack. Touch sensing Gesture recognition, by adding directionality to the sensing elements combined with computational imaging. Fig. 2: Different sensors can share the same NIR microLEDs and microPDs, and the distribution of the components is flexible, allowing for high- and low-density areas depending on the sensor requirements. Rainer Minixhofer and Jean-Jacques Drolet of ams OSRAM provide an in-depth examination of the applications and technology of microLEDs for In-Display Sensing in a paper written for the Society for Information Display . A new supply chain for display manufacturing The vision for in-plane display sensing enabled by microLEDs is a simpler system architecture with enhanced sensor functionality, lower power, and lower sensor costs. There are still essential technical development steps to be made before this vision becomes real and in-plane display sensing is available in the first products. When sensing is integrated in-plane within the display, the optical signal chain requires a complex set of interfaces that provide connections between the RGB and NIR micro-emitters, their microIC pixel-drivers, the microPDs and their read-out circuit, signal processing circuitry, other display elements, and the device’s SoC (see Figure 3). ams OSRAM is working to address the challenge that in-plane sensing brings by working together with technology suppliers, display manufacturers, display driver and system-on-chip (SoC) manufacturers, OEMs, customers and other stakeholders. ams OSRAM is developing the alliances, standards and specifications required to pull together the complex new supply chain that can bring in-plane sensing to the market. Fig, 3; In-plane sensing in a microLED display involves the integration of systems and components from multiple suppliers. A new kind of supply chain is required to produce this new type of display. Three key items need to be in place to enable sensing beside μDiscretes: (1) Sensor μDriver, (2) display integration, and (3) SoC support.ledoptical sensingams osramsensor