Panasonic and Toshiba Co-operate on Highly Intergrated Panasonic Module

Resistor+caps — Fri, 08 Oct 2021 05:28:00 GMT

Current Revision posted to Documents by Resistor+caps on 10/8/2021 5:28:00 AM

The module will combine Panasonic’s design and manufacturing expertise in module production with Toshiba’s single chip TC35661 Bluetooth semiconductor device and software.

It will round off Panasonic’s module portfolio by offering an easy to integrate module with various embedded, Bluetooth qualified profiles.

PAN1026 is based on Toshiba’s single chip TC35661 Bluetooth semiconductor device and Toshiba software stack. The TC35661 is a highly integrated and compact Bluetooth controller that delivers high-speed operation at ultra-low power. It significantly reduces external component count and power consumption in applications requiring Bluetooth 2.1 or 3.0 with EDR (enhanced data rate) and also supports Bluetooth 4.0 functionality. HCI, as well as embedded SPP version is available. This provides the low-power and rapid connection and disconnection that is needed by a wide range of applications and smaller form factor devices. The PAN1026 Module is manufactured in a very small 15.6 x 8.7 x 1.9 mm³ SMD package with shielded case and will be qualified, according to the Bluetooth 2.1 and 4.0 standard.

For More Information Please Contact Ian Needham@ Ian.needham@eu.panasonic.com

Tags: wireless_modules