https://community.element14.com/products/manufacturers/ en-USTelligent Community 12https://community.element14.com/products/manufacturers/st/b/blog/posts/live-webinar-new-nfc-readers-to-watch-in-2026-tuesday-1st-of-septemberThu, 06 Aug 2026 12:56:00 GMT93d5dcb4-84c2-446f-b2cb-99731719e767:2da82669-4055-46fc-a5d7-952d8f63c1f8Em_STHi All, We are please to offer this Webinar. From entry-level to high-performance, our new ST25 NFC reader lineup delivers market-leading figures and gives designers more choice than ever. Our portfolio now spans from analog front-end to stand-alone NCI readers. Please register here : Webinar: New NFC readers to watch in 2026 - STMicroelectronics Tuesday, September 01, 2026 ► 3:00 pm CEST | EMEA session ► 2:00 pm EDT | Americas session Agenda Discover how new industry-first NFC features can help you create more capable designs Quickly identify the best NFC reader for your use case: Wireless charging Aliro for access control Contactless payment Accessory/consumable identification, and more. See our new NFC readers in action (demo) Learn how to get started fast (development boards, reference designs, ...) Register today to secure your spot, ask your questions live, and see which NFC reader fits your next design. Thanks Em.readersdevelopernew productsstmDesignwireless chargingnfcstmicroelectronicswebinarstmicroconnectivityhttps://community.element14.com/products/manufacturers/tdk/b/blog/posts/new-release-vibration-resistant-axial-and-soldering-star-capacitors-for-125-v-and-upgrades-63-v-seriesWed, 05 Aug 2026 08:13:00 GMT93d5dcb4-84c2-446f-b2cb-99731719e767:72cc0ecf-5db9-4ec8-b045-b2148a1a50aeCatinca - TDKBecause Every Component You Remove Makes the System Better. Designing compact 96 V battery systems isn't only about fitting more power into less space. It's about reducing complexity, improving reliability, and making every cubic centimeter count. Our latest aluminum electrolytic capacitor portfolio helps engineers do exactly that. The new 125 V axial and soldering-star capacitors eliminate the need to connect capacitors in series for many 96 V DC-link designs. The result? Simpler capacitor banks, lower assembly effort, fewer components, and robust performance even under demanding thermal and vibration conditions. Together with the upgraded 63 V series, the portfolio supports applications ranging from micromobility and small xEVs to forklifts, electric boats, industrial electronics, and even humanoid robots. Read more: Axial and soldering-star capacitors for 125 V and upgrades 63 V series | TDK Electronics - TDK Europe Buy from Farnell: B43693 Leaded Aluminium Electrolytic Capacitors | Farnell® UK B43793 Leaded Aluminium Electrolytic Capacitors | Farnell® UK B41687 Leaded Aluminium Electrolytic Capacitors | Farnell® UK B41787 Leaded Aluminium Electrolytic Capacitors | Farnell® UKTDKUnited hashtag#PowerElectronics hashtag#Capacitors hashtag#DCLink hashtag#EMobility hashtag#IndustrialElectronicshttps://community.element14.com/products/manufacturers/multicomp-pro/w/documents/27920/behind-hypershock-designing-building-and-repairing-a-battlebots-legendThu, 30 Jul 2026 20:52:00 GMT93d5dcb4-84c2-446f-b2cb-99731719e767:3c5ae2c8-833b-4ecc-bb73-88101a56c339JC@Multicomp ProThis season, the element14 Community goes behind the scenes with Team HyperShock, bringing you exclusive content that puts real‑world engineering front and center. Sponsored by Multicomp Pro , this Community production showcases how professional‑grade tools and test equipment are used in one of the most demanding applications imaginable: competitive combat robotics. What’s Coming Throughout the BattleBots Pro League season, members of Team HyperShock will share their experience, insights, and hard‑won lessons directly with the element14 Community. HyperShock Hacks A new series of short, practical videos hosted by Team HyperShock, highlighting hands‑on tips straight from the build and repair process. Team Interviews & Community Content Go deeper with behind‑the‑scenes interviews, engineering discussions, and insights into how HyperShock prepares for competition * Plus Community giveaways and special features throughout the season. About the Sponsor: Multicomp Pro – the engineer’s choice – is proud to sponsor Team HyperShock in this season’s BattleBots competition. See the power supply, thermal imager, and more that they used to build their bot. Multicomp Pro , the Engineer’s Choice, offers a portfolio of more than 70,000 products designed to meet the quality standards engineers expect—while delivering savings compared to branded alternatives. The range supports engineers at every level and spans test and measurement, power, tools, enclosures, and electromechanical components, making it well suited for education, production‑ready designs, and even builds tough enough to survive the BattleBox—like HyperShock! Explore the Multicomp Pro range Catch Up on Past Content from Previous Seasons The element14 Community already hosts content from previous seasons, including: Watch the behind the scenes & exclusive interview videos with Team HyperShock and James Lewis . Recorded AMA (Ask Me Anything) with Will Bales, captain of Team HyperShock. Multicomp Pro, the Engineer’s Choice, offers a portfolio of more than 70,000 products designed to meet the quality standards engineers expect—while delivering savings compared to branded alternatives. The range supports engineers at every level and spans test and measurement, power, tools, enclosures, and electromechanical components, making it well suited for education, production‑ready designs, and even builds tough enough to survive the BattleBox—like HyperShock! Build and Repair like Team Hypershock and Explore the Multicomp Pro range ! Exclusive interview & Behind the Scenes Videos https://youtu.be/UG95J8-Jv2c https://youtu.be/a_Nbf06Zy7k https://youtu.be/8jMdjuBpIGc https://youtu.be/27zdy0NGPoI https://youtu.be/ZBiWTeZmaWE Have YOU Wondered How the HyperShock BattleBot Works? Find out in our Ask Me Anything webinar with Team HyperShock! Watch Recording of the event where Will Bales answered Community questions about HyperShock, from its controllers and drive trains to the deadly vertical spinner. community.element14.com/.../multicomp-pro-at-BattleBots.mp4 Exclusive Interview with Will Bales of Team HyperShock and James Lewis James Lewis from WorkBench Wednesdays , AKA The Bald Engineer leaves his own lab to visit the Pits of BattleBots and joins Team HypberShock in their lab for the filming of The BattleBots World Championship VII. Join James and Team Captain Will Bales, as we take the armor off their bot Hypershock to get a better understanding what’s inside. Watch Videos Try the Multicomp Pro tools Entrusted by Team HyperShock Product Name Manufacturer Quantity Buy Kit Raspberry Pi 5-STARTER KIT-8GB Multicomp Pro 1 Buy Now Soldering Station, 65W Multicomp Pro 1 Buy Now Benchtop Soldering Fume Extractor, ESD-Safe Multicomp Pro 1 Buy Now Wide Range Bench Power Supply, 60V, 15A Multicomp Pro 1 Buy Now Handheld Digital Multimeter, True RMS Multicomp Pro 1 Buy Now Handheld Digital Tachometer Multicomp Pro 1 Buy Now Heat Gun Multicomp Pro 1 Buy Now Hard-shell case - yellow, polymer, 216 mm x 571.5 mm x 419 mm Multicomp Pro 1 Buy Now Wire, PTFE, White, 28 AWG Multicomp Pro 1 Buy Now Tool Set: 183-Pcs of Screwdriver, Bit & Ratchet Handle, Pliers and more Multicomp Pro 1 Buy Now Tool Bag Multicomp Pro 1 Buy Now Digital Caliper, LCD 4-WAY Multicomp Pro 1 Buy Now Adhesive lined heatshrink, 3:1 1" Multicomp Pro 1 Buy Now Crimp Tool Multicomp Pro 1 Buy Now Crimp Die Multicomp Pro 1 Buy Nowmulticomp prohypershockbattlebotshttps://community.element14.com/products/manufacturers/multicomp-pro/m/managed-videosThu, 30 Jul 2026 13:52:00 GMT93d5dcb4-84c2-446f-b2cb-99731719e767:da5ec914-c2e5-4297-85f9-28241b0ad660https://community.element14.com/products/manufacturers/multicomp-pro/m/managed-videos/151545Thu, 30 Jul 2026 13:52:00 GMT93d5dcb4-84c2-446f-b2cb-99731719e767:3e984e46-1084-4dec-b134-75edfb9fbb66e14cstantonhttps://community.element14.com/products/manufacturers/tdk/b/blog/posts/tdk-dc-link-capacitors-with-ultra-low-inductance-for-sic-based-power-electronicsWed, 29 Jul 2026 11:44:00 GMT93d5dcb4-84c2-446f-b2cb-99731719e767:3291a68c-bf86-4acc-9f4a-f9ed9a739653Catinca - TDKTaming SiC Starts with What You Can't See As switching frequencies increase, parasitic inductance becomes a critical design challenge. Even small amounts of ESL can contribute to voltage overshoots, additional stress on power semiconductors, and reduced system reliability. Our latest MKP DC HF capacitor platform was developed to address exactly these challenges, combining ultra-low inductance with high ripple-current capability for next-generation SiC-based power electronics. Curious how capacitor design can influence inverter performance? DC-Link capacitors for SiC-based power | TDK Electronics - TDK Europe Buy from Farnell: B25696H Power Film Capacitors | Farnell® UKPowerElectronics hashtag#SiC hashtag#WideBandgap hashtag#PowerConversion hashtag#EnergyStorage hashtag#IndustrialAutomationhttps://community.element14.com/products/manufacturers/amphenol/b/blog/posts/why-compact-connectivity-matters-in-modern-roboticsMon, 27 Jul 2026 14:26:00 GMT93d5dcb4-84c2-446f-b2cb-99731719e767:689eab20-a003-4ea2-be10-492cdd06c207Julia_St.HilaireAs robotic systems become more intelligent and capable, engineers are under increasing pressure to deliver more functionality within smaller footprints. From collaborative robots (cobots) and autonomous mobile robots (AMRs) to advanced machine vision systems, modern automation platforms require compact, reliable, and high-performance connectivity solutions. Meeting these demands requires more than processing power and software, it requires connectivity solutions capable of supporting increasingly dense electronic architectures. The Push Toward Smaller, Smarter Robotics Today's robotic systems integrate a growing number of components, including sensors, cameras, processors, communication modules, and power management systems. As these capabilities expand, there are several challenges: Limited PCB space Increasing component density Higher data transmission requirements Reliability in industrial environments The ability to maximize board space while maintaining reliable electrical connections has become a critical design consideration. Why Board-to-Board Connectivity Matters Many robotic systems rely on multiple printed circuit boards working together within a compact enclosure. Reliable board-to-board connections help ensure communication between critical subsystems while supporting increasingly sophisticated functionality. Poor connector selection can lead to signal integrity issues, design constraints, and maintenance challenges that impact overall system performance. As robotics continue to evolve, compact and reliable board-to-board connectivity becomes increasingly important. BergStak® Connectors for Space-Constrained Designs ACS BergStak® connectors are designed to help engineers maximize PCB real estate without sacrificing performance. The BergStak® family offers a range of fine-pitch, high-density solutions that help engineers maximize board space while maintaining reliable electrical performance. BergStak® 0.40 mm Connector: For highly compact robotic systems, the BergStak® 0.40 mm connector series is one of the most space-efficient options within the portfolio. Key Features Ultra-fine 0.40 mm pitch High-density board-to-board architecture Multiple stack height options Various pin count configurations High-Speed performance of 16Gb/s Advantages Supports high-density board-to-board interconnection Supports applications need transfer HS signal s Supports different application requirements with multiple stack heights Provides higher retention force with the optional metal hold-down Since robotics designs continue shrinking while adding more functionality, the 0.40 mm series is particularly valuable for highly integrated control systems. BergStak® 0.50 mm Connector: For applications requiring a balance between density and design flexibility, the BergStak® 0.50 mm series offers a 0.50mm pitch, high-density, low-profile design with multiple stack heights and a wide range of positions. Key Features 0.50 mm pitch Board-to-board connectivity Flexible stack heights Reliable signal transmission Compact design Advantages High density connector, suitable for applications with space constraints Offers higher retention force with the optional metal hold-down. Wide range of sizes and stack heights supports different applications BergStak® 0.80 mm Connector: For robotic systems requiring additional mechanical robustness and higher pin-count board connections, the BergStak® 0.80 mm series may be a better fit. Key Features 0.80 mm pitch High-density board-to-board connectivity Multiple pin-count options Flexible stack heights S upports data rates up to 12 Gb/s Advantages Comprehensive range of sizes and stack heights to satisfy all need High-density for all electrical applications needs Satisfies different application requirements videos.amphenol-cs.com/.../bergstak®-0.40mm-connector Supporting the Future of Automation As factories continue to adopt Industry 4.0 technologies, robotic systems are becoming more connected and data driven. This shift requires compact electronics capable of processing and transmitting increasing amounts of information. By enabling high-density board-to-board connections, BergStak® connectors help engineers develop smaller, more capable systems that can support the growing demands of modern automation. Looking Ahead The next generation of robotics will continue to push the limits of system density, intelligence, and performance. Connectivity solutions that maximize available space while maintaining reliability will play an increasingly important role in enabling these advancements. For engineers designing compact automation systems, board-to-board connectivity is no longer simply a component selection, but rather, it is a critical design decision. What do you see as the biggest challenge in designing next-generation robotic systems? Share your experience in the comments below!Board to Board connectorsAmphenol Communications Solutionsindustrial electronicsroboticsCompact DesignBergStakminiaturizationHigh Densityhttps://community.element14.com/products/manufacturers/tdk/b/blog/posts/tdk-system-oriented-component-design-for-industrial-drivesTue, 21 Jul 2026 08:24:00 GMT93d5dcb4-84c2-446f-b2cb-99731719e767:2e06031b-c651-43c6-98d5-09286d1d84b5Catinca - TDKVariable-Speed Drives All Follow The Same Principle. Until Physics In. At their core, variable-speed drives all do the same thing: they regulate voltage and frequency to operate electric motors efficiently. The principle is straightforward. Designing a drive that performs reliably under real operating conditions is not. As power levels increase, every engineering decision carries more weight. Input protection. EMI filtering. Power conversion. DC-link stabilization. Current sensing. Output filtering. Each functional block influences the next. And ultimately, every design decision shapes the overall performance, efficiency, and reliability of the system. Because successful drive design isn't about optimizing individual components. It's about engineering an architecture where each building block interact seamlessly. That's where design confidence begins. Read more: Industrial Drives Solutions | TDK Electronics - TDK EuropeIndustrialAutomation hashtag#PowerElectronics hashtag#IndustrialDrives hashtag#MotorDriveshttps://community.element14.com/products/manufacturers/ams_osram/b/blog/posts/how-can-optical-technology-enable-non-invasive-assessment-of-long-term-metabolic-stressTue, 21 Jul 2026 07:28:00 GMT93d5dcb4-84c2-446f-b2cb-99731719e767:4e43f303-c013-427b-b62c-9a15d96d31bdCorinnaR.Wearable devices are highly effective at monitoring real-time physiological parameters such as heart rate, blood oxygen saturation, and other vital signs. While these measurements provide valuable information about the body's current state, some physiological changes develop gradually and may not be apparent from momentary readings alone. One emerging approach is the measurement of Advanced Glycation End Products (AGEs) via skin autofluorescence. AGE-related signals are associated with long-term metabolic processes and can provide additional physiological context beyond traditional vital sign monitoring. For engineers developing next-generation wearables and medical devices, the challenge is to integrate this capability into compact, robust systems. Recent advances in multi-wavelength optical components demonstrate how AGE measurement can be combined with established optical sensing functions within a single architecture, enabling both heart-rate monitoring and AGE assessment. In our latest article, we explore how optical sensing technology enables non-invasive AGE measurement and why this supplementary vital sign could help expand the capabilities of wearable and point-of-care devices. Read the full article: More than a snapshot in time: Supplementary vital sign offers deeper insight into long-term health risks | ams OSRAMvital sign monitoringHealthams osrammedicalsensorhttps://community.element14.com/products/manufacturers/amphenol/b/blog/posts/the-future-of-e_2d00_mobility-connectivity-challenges-in-next_2d00_generation-electric-vehiclesMon, 20 Jul 2026 15:08:00 GMT93d5dcb4-84c2-446f-b2cb-99731719e767:dbd21546-b91a-48f6-a04e-fa1229bfdebdJulia_St.HilaireThe rapid growth of electric vehicles (EVs) is transforming the automotive industry. As manufacturers continue to increase driving range, charging speed, and vehicle intelligence, the demands placed on vehicle connectivity systems are also evolving. From battery management systems and power distribution units to advanced driver assistance systems (ADAS), modern EVs rely on robust interconnect solutions capable of supporting higher voltages, increased data transmission, and harsh operating environments. New Demands for Vehicle Connectivity Compared to traditional vehicles, EVs require significantly more electrical and electronic content. This creates new challenges for designing next-generation mobility platforms. Key design considerations include: Higher voltage requirements Increased power density Greater data transmission needs Weight reduction Reliability in harsh environments As vehicle architecture becomes more complex, connectivity solutions play an increasingly important role in overall system performance and safety. Reliability Under Harsh Conditions Automotive environments expose connectors to vibration, temperature fluctuations, moisture, and contaminants throughout their service life. To ensure long-term performance, there must be interconnect solutions designed to withstand these demanding conditions while maintaining reliable electrical connections. ACS solutions such as DuraEV ™ connectors are specifically engineered for electric vehicle applications, helping support high-voltage power distribution while meeting the durability requirements of modern transportation systems. Key features include: Designed for high-voltage EV applications Ruggedized construction for demanding automotive environments Integrated connector locking mechanisms for secure mating Protection against vibration and mechanical stress Environmental sealing options for harsh operating conditions Support for battery systems, power distribution units, and charging applications DuraEV ™ Connector for Swappable Battery Systems One of the most unique members of the DuraEV ™ family is the connector designed specifically for swappable battery applications. Key Features Up to 74A rated current Up to 1000 mating cycles Integrated connector locking mechanism Finger protection design Floating contact structure Optional first-mate-last-break (FMLB) power terminals Optional IP67 sealing protection videos.amphenol-cs.com/.../duraev-|-connector-for-swappable-fixed-batteries-with-connector-lock Connectivity Beyond Power Vehicle systems now rely on advanced sensors, cameras, communication modules, and ADAS technologies that require reliable high-speed data transmission. As the industry moves toward autonomous and software-defined vehicles, there must be a balance of both power and data connectivity requirements within increasingly compact vehicle architectures. Looking Ahead The transition to electric mobility is creating new opportunities and new engineering challenges. As manufacturers continue to push the boundaries of performance, efficiency, and intelligence, connectivity will remain a critical enabling technology. By combining high-voltage power solutions with reliable data interconnects, engineers can help build the next generation of safer, smarter, and more efficient vehicles. As EV architecture continues to evolve, what connectivity challenge are you encountering most often in your designs? Share your experience in the comments below!Amphenol Communications Solutionsautomotive electronicsPowerLokpower distributionelectric vehiclesAutomotive connectivityDuraEVEV Charginghttps://community.element14.com/products/manufacturers/st/b/blog/posts/update-now-ready-for-orders-introducing-the-very-new-vl53l9cxv0ve-1-with-steval-vl53l9-and-x-nucleo-53l9a1Mon, 20 Jul 2026 10:38:00 GMT93d5dcb4-84c2-446f-b2cb-99731719e767:dbb9aabe-97fa-49d0-b6c8-da43cb7e6029Em_STHi All, I am happy to say, we are now ready to take orders. Please may I introduce our very new 3D dToF LiDAR all-in-one module with accompanying boards. There is a wealth of information contained within this article and on our site. VL53L9CXV0VE/1 The VL53L9CX is STMicroelectronics’ dToF 3D lidar all-in-one module, offering a high spatial resolution of 2.3 K zones. It features a 71° diagonal FoV, with 1° angular resolution across a 55° x 42° FoV. It also delivers accurate ranging from below 5 cm to 9 m. VL53L9CX | Product - STMicroelectronics As always we have boards to help with development: X-NUCLEO-53L9A1 Time-of-Flight expansion board based on the VL53L9CX for STM32 Nucleo X-NUCLEO-53L9A1 | Product - STMicroelectronics STEVAL-VL53L9 Evaluation board based on VL53L9CX Time of Flight sensor STEVAL-VL53L9 | Product - STMicroelectronics Please watch out You tube video here: https://www.youtube.com/watch?v=rPXWrvsEOE8 You can can register interest / buy here: X-NUCLEO-53L9A1 STMICROELECTRONICS, EVAL BOARD, 3D TIME-OF-FLIGHT SENSOR | Farnell® UK STEVAL-VL53L9 STMICROELECTRONICS, EVAL BOARD, 3D TIME-OF-FLIGHT SENSOR | Farnell® UK VL53L9CXV0VE/1 STMICROELECTRONICS, 3D DTOF LIDAR MODULE, MIPI I3C, 9M | Farnell® UK Thanks Em.lidarvisionevalexapansion boardstmicroelectronicsevaluation boardstmicrosttofkittime of flightsensornucleo