Power Interconnect Solutions: Increasing current density and reliability

marklevy9 — Thu, 07 Oct 2021 03:27:35 GMT

Current Revision posted to Documents by marklevy9 on 10/7/2021 3:27:35 AM

Webinar Registration Link Specifically for Element 14

http://www.tycoelectronics.com/industry/datacenter/power_webinar/webinar_power.asp?S_cid=2337

Join Tyco Electronics’ director of engineering, Don Wood, and global product manager, Mike Blanchfield, for a 30 minute webinar to discuss critical issues related to high current density power distribution, how to minimize and better dissipate heat generated in the connector, and how to predict the performance across a variety of PCB thicknesses and ambient conditions.

The demand for increased current density with modular power solutions has been met by a new breed of power interconnects from Tyco Electronics. The new designs make better use of available airflow and provide improvements in long-term reliability. Specific challenges related to energized mate and un-mate cycles and exposure to corrosion enhancing environments while maintaining low milli-volt drops are addressed with new contact designs and material selections. While de-facto standard solutions fall short of meeting future needs, Tyco Electronics offers upgraded power connectors that meet the needs of many applications in the computer, telecommunications and industrial power distribution markets.

A brief question and answer session will conclude the webinar presentation