<?xml-stylesheet type="text/xsl" href="https://community.element14.com/cfs-file/__key/system/syndication/rss.xsl" media="screen"?><rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:slash="http://purl.org/rss/1.0/modules/slash/" xmlns:wfw="http://wellformedweb.org/CommentAPI/"><channel><title>Repairing &amp;amp; Avoiding Electronic Faults with Thermal Paste</title><link>/products/pcbprototyping/b/pcb-blogs/posts/repairing-avoiding-electronic-faults-with-thermal-paste</link><description>Thermal grease, also known as thermal paste or thermal compound, is a substance used to improve the thermal conductivity between two surfaces, typically between a microprocessor and a heat sink. The purpose of thermal grease is to fill in the microsc</description><dc:language>en-US</dc:language><generator>Telligent Community 12</generator><item><title>RE: Repairing &amp;amp; Avoiding Electronic Faults with Thermal Paste</title><link>https://community.element14.com/products/pcbprototyping/b/pcb-blogs/posts/repairing-avoiding-electronic-faults-with-thermal-paste</link><pubDate>Wed, 14 Feb 2024 13:56:10 GMT</pubDate><guid isPermaLink="false">93d5dcb4-84c2-446f-b2cb-99731719e767:3ef40925-c3cb-4a0c-8552-19db921e8bd5</guid><dc:creator>cstanton</dc:creator><slash:comments>1</slash:comments><description>&lt;p&gt;[mention:c08d19f637744ad7aafdc1ecd8e2e4c7:e9ed411860ed4f2ba0265705b8793d05]&amp;nbsp; what are your thoughts on the introduction of liquid metal (&lt;a id="" href="https://www.thermal-grizzly.com/en/conductonaut/s-tg-c-001-r" rel="noopener noreferrer nofollow" target="_blank" data-e14adj="t"&gt;https://www.thermal-grizzly.com/en/conductonaut/s-tg-c-001-r&lt;/a&gt;) as opposed to traditional pastes? Especially with the increasing need of direct-die application as opposed to the&amp;nbsp;heat-spreader available on processors?&lt;/p&gt;&lt;img src="https://community.element14.com/aggbug?PostID=27647&amp;AppID=385&amp;AppType=Weblog&amp;ContentType=0" width="1" height="1"&gt;</description></item></channel></rss>