RX23W BLE 5.0 Module Target Development Board - Review

Name: RX23W BLE 5.0 Module Target Development Board
Rating: 3.8888890 (3 reviews)

vinayyn over 4 years ago

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RoadTest: RX23W BLE 5.0 Module Target Development Board

Author: vinayyn

Creation date: 7 Sep 2021

Evaluation Type: Development Boards & Tools

Did you receive all parts the manufacturer stated would be included in the package?: True

What other parts do you consider comparable to this product?: NRF52 Development Kit

What were the biggest problems encountered?: Finding The Related Detailed Documents for Design

Detailed Review:

BLE(Bluetooth Low Energy) technology has revolutionized wireless communications By its Popularity and simple characteristics. It allows devices to communicate without Consuming More Power and by maintaining high levels of security. Because of its low power and low cost, BLE has played crucial importance in the evolution of IoT applications from Wearable Devices, high-speed automotive devices to complex medical devices.

Out Of the Box RX23W BLE 5.0 Module Target Development Board

RX23W BLE 5.0 Module Target Development Board

Block Diagram of RX23W BLE 5.0 Module Target Development Board

The external appearance of the top side of the RX23W BLE 5.0 Module Target Development Board

Features Of RX23W BLE 5.0 Module Target Development Board

R5F523W8CDLN Evaluation MCU

On-chip memory: 512-KB ROM, 64-KB RAM, 8-KB E2 data flash memory

On Board 1 User, Interfacing Switch
On Board 2 User, Interfacing LED
Current Consumption Measurement Headers
External Power Supply connection Headers
Connector for an on-board emulator: USB Micro-B
Connector for a USB serial-conversion interface: USB Micro-B
PMOD Connectors
Arduino Uno Interfacing Headers
Maximum transmission output power: 4 dBm (in 4-dBm output mode
USB connector: 5-V input
Power-supply IC: 5-V input, 3.3-V output

Description Of Features Of RX23W BLE 5.0 Module Target Development Board

1. Evaluation MCU R5F523W8CDLN Features(RX23W Group)

32-bit RXv2 CPU core

Max. operating frequency: 54 MHz Capable of 88.56 DMIPS in operation at 54 MHz
Enhanced DSP: 32-bit multiply-accumulate and 16-bit multiply-subtract instructions supported
Built-in FPU: 32-bit single-precision floating-point (compliant to IEEE754)
Divider (fastest instruction execution takes two CPU clock cycles)
Fast interrupt
CISC Harvard architecture with 5-stage pipeline
Variable-length instructions, ultra-compact code
On-chip debugging circuit
Memory protection unit (MPU) supported

Low power design and architecture

Operation from a single 1.8-V to 3.6-V supply
RTC capable of operating on the battery backup power supply
Three low power consumption modes
Low power timer (LPT) that operates during the software standby state

On-chip flash memory for code

384- to 512-Kbyte capacities
On-board or off-board user programming
Programmable at 1.8 V
For instructions and operand

On-chip data flash memory

8 Kbytes (1,000,000 program/erase cycles (Typ.))
BGO (Background Operation)

On-chip SRAM, no wait states

64-Kbyte size capacities

Reset and supply management

Eight types of reset, including the power-on reset (POR)
Low voltage detection (LVD) with voltage settings

Clock functions

Main clock oscillator frequency: 1 to 20 MHz
External clock input frequency: Up to 20 MHz
Sub-clock oscillator frequency: 32.768 kHz
Frequency of Bluetooth-dedicated clock oscillator: 32 MHz
PLL circuit input: 4 MHz to 12.5 MHz
On-chip low- and high-speed oscillators, dedicated on-chip low-speed oscillator for the IWDT
USB-dedicated PLL circuit: 4, 6, 8, or 12 MHz 54 MHz can be set for the system clock and 48 MHz for the USB clock
Generation of a dedicated 32.768-kHz clock for the RTC
Clock frequency accuracy measurement circuit (CAC)

Realtime clock

Adjustment functions (30 seconds, leap year, and error)
Calendar count mode or binary count mode selectable
Time capture function
Time capture on event-signal input through external pins

Independent watchdog timer

15-kHz on-chip oscillator produces a dedicated clock signal to drive IWDT operation.

Capacitive touch sensing unit

Self-capacitance method: A single pin configures a single key, supporting up to 12 keys
Mutual capacitance method: Matrix configuration with 12 pins, supporting up to 36 keys

Up to 12 communication functions

Bluetooth Low Energy (1 channel) An RF transceiver and link-layer compliant with the Bluetooth 5.0 Low Energy specification
LE 1M PHY, LE 2M PHY, LE Coded PHY (125 kbps and 500 kbps), and LE Advertising extension support
On-chip Bluetooth-dedicated AES-CCM (128-bit blocks) encryption circuit
The 83-pin LGA product has been certified as compliant with radio-related laws (in Japan, North America, and Europe).
The 83-pin LGA product includes a small PCB trace antenna.
USB 2.0 host/function/On-The-Go (OTG) (one channel), full-speed = 12 Mbps, low-speed = 1.5 Mbps, isochronous transfer, and BC (Battery Charger) supported
CAN (one channel) compliant to ISO11898-1: Transfer at up to 1 Mbps
SCI with many useful functions (up to 4 channels) Asynchronous mode, clock synchronous mode, smart card interface Reduction of errors in communications using the bit modulation function
IrDA interface (one channel, in cooperation with the SCI5)
I2C bus interface: Transfer at up to 400 kbps, capable of SMBus operation (one channel)
RSPI (one channel): Transfer at up to 16 Mbps
Serial sound interface (one channel)
SD host interface (optional: one channel) SD memory/ SDIO 1-bit or 4-bit SD bus supported

Up to 19 extended-function timers

16-bit MTU: input capture, output compare, complementary PWM output, phase counting mode (five channels)
16-bit TPU: input capture, output compare, phase counting mode (six channels)
8-bit TMR (four channels)
16-bit compare-match timers (four channels)

12-bit A/D converter

Capable of conversion within 0.83 μs
14 channels
Sampling time can be set for each channel
Self-diagnostic function and analog input disconnection detection assistance function

12-bit D/A converter

Two channels

Analog comparator

Two channels × one unit

General I/O ports

5-V tolerant, open drain, input pull-up, switching of driving capacity

2. Emulator

An emulator is mounted on the board. With the settings as shipped, the switches are shown in the below figure is turned off and the emulator is in the reset state. To use the emulator, make the corresponding switch setting in The Table.

The shape of the emulator connector (ECN1) is USB micro-B for the IDE and for the Renesas Flash Programmer (RFP). Connect the emulator connector to the computer by a USB cable. If the power supply on the host side is on, the power is supplied to this product at the same time as the connection of the cable.

3. USB-to-Serial Conversion

USB connector CN1 is connected to the USB-to-serial conversion module from FTDI and can be used as a virtual COM port. Table Below shows the connection relationship of USB-to-serial signals

Names of the USB-to-Serial Signals

The first time the CPU board is connected to the USB port of a PC, the monitor of the PC shows the message stating that installation of the driver is in progress as shown below Figure. After that, a message indicating completion of the driver installation is displayed. The content of the message will differ from the OS version on the host PC

Displays Indicating Installation of the USB-to-Serial Driver

If you do not have a driver, download the installer for the driver from the Web site of FTDI .https://ftdichip.com/drivers/

4. ACT LED

The ACT LED displays the state of operation of the emulator control software. The illumination conditions are listed below. The LED is green.

Illuminated: Indicates that the emulator is connected to the target.
Blinking: Indicates that the host machine (PC) has recognized the emulator.
Not illuminated: Indicates that the emulator cannot be used for some reason (including its power being off)

5. Power LED

While the power LED is illuminated, power is being supplied to the board. The LED is green.

6. User LEDs

The optional user LEDs can be used for any purpose. LED0 and LED1 are mounted on the board and are respectively connected to the following ports. The LEDs are green

LED0: Pin 47, connected to port PC0

LED1: Pin 53, connected to port PB0

7. External Power-Supply Header

When more current is required than the USB is capable of supplying, use the external power-supply header (J1) to supply power. The usable voltage is 3.3 V. When this header is to be used, remove the pattern for cutting (SS19) on the soldered side, electrically separating the emulator from the target.

The figure below shows the position of the pattern for cutting.

The below Figure shows the position of the external power-supply header (the actual header component is not mounted on the board as shipped)

8. Pmod Connector

The specification of the Pmod connector (CN2) is on the assumption that Pmod modules are to be connectable. CN2 is for connection to Pmod Interface Type 6A (Type 6 + Type 1) modules* in the product as shipped. Remodeling of the board by removing patterns for cutting enables the connection of CN2 to Type 2A or Type 3A modules. Use Pmod modules for operation at the same potential as that for the evaluation MCU. However, we do not guarantee connection to all types of Pmod modules. Confirm the specifications of this product against any Pmod module you intend to use.

Note: The specifications of Type 6A differ from those described in the Pmod interface specification of Digilent.

Pin Assignments of the Pmod Connector

9. Arduino UNO Headers

For the J2, J3, J4, and J5 headers, through-holes are assigned with a pitch of 2.54 mm, and these headers are connected to the evaluation MCU according to the Arduino UNO R3 specification.

Pin Assignments of J2 (6-Pin Analog Connector)

Pin Assignments of J3 (8-Pin Power Connector)

Pin Assignments of J4 (8-Pin Digital Connector)

Pin Assignments of J5 (10-Pin Digital Connector)

10. Current Measurement Header

The current measurement header (JP1) is used to measure the current drawn by the evaluation MCU (an actual header component is not mounted on the board as shipped). The current drawn can be measured by connecting an ammeter to the evaluation MCU. When this header is to be used, remove the relevant pattern for cutting (SS20) on the soldered side. The figure below shows the positions of the header and pattern for cutting.

11. MCU Headers

MCU headers are provided for by two sets of through holes (CN3 and CN4) for 36-pin headers (actual header components are not mounted on the board as shipped). The pin headers have a pitch of 2.54 mm and are connected to the evaluation MCU. Pin numbers of the MCU headers correspond to those of the evaluation MCU, and most pins are connected (with pins 3, 6, 9 to 20, 33, 35, 36, and 73 to 83 as the exceptions).

12. Reset Switch

Pressing the RESET switch applies a hardware reset to the evaluation MCU

13. User Switch

An optional user switch (SW1) is mounted. It is connected to pin 42 of the evaluation MCU, which operates as pin function P15. The IRQ5 interrupt is multiplexed on the same pin.

Advantages of RX23W BLE 5.0 Module Target Development Board

Large On-chip memory
Low Power Consumption
Low Cost

Every Wearable design's main concern is the Size Of the Main microcontroller and the Memory size. RX23W group BLE is perfect For Wearable applications.

Renesas Try BT App interfacing with The RX23W BLE 5.0 Module Target Development Board

We can check the RX23W BLE Target Board Communication with the Android Application. The Demo Firmware is Factory Preloaded, we just need to connect the Target Board with The Mobile application. The App Try BT Can be download from the app store. By connecting the Target board with the app let's try the LED Light Up Demo. In below video you can see the demo.

RX23W BLE 5.0 Module Target Development Board