/technologies/fpga-group/b/blog/posts/what-do-you-think-about-xilinx-s-16nm-zu1-2-3-info-packageHave you heard about Xilinx’s latest release in the 16nm line, the ZU1/2/3 InFO package? This package uses 60% less area and is roughly 70% thinner than standard Zynq UltraScale+ chip. InFO (for those that don’t know) stands for Integrated Fan-Out. Ten-USTelligent Community 12https://community.element14.com/technologies/fpga-group/b/blog/posts/what-do-you-think-about-xilinx-s-16nm-zu1-2-3-info-packageWed, 20 Jul 2022 23:54:16 GMT93d5dcb4-84c2-446f-b2cb-99731719e767:ce24704c-704e-496a-9238-6b8135f1363ddhill9720<p>Hello [mention:05f0185f60914992874f424b7b1c00fb:e9ed411860ed4f2ba0265705b8793d05]</p> <p>I have managed to confuse myself about HDI, and was hoping you can clear this up.&nbsp;</p> <ul> <li>Is HDI a PCB design technique or is it a PCB material? I have found conflicting documents on this on the web.</li> <li>If it&rsquo;s a technique when you mention FR4 in the article does that mean FR4 cannot be used on InFO package PCB because it cannot support HDI techniques?</li> </ul> <p>`Thanks!</p><img src="https://community.element14.com/aggbug?PostID=11620&AppID=19&AppType=Weblog&ContentType=0" width="1" height="1">