<?xml-stylesheet type="text/xsl" href="https://community.element14.com/cfs-file/__key/system/syndication/rss.xsl" media="screen"?><rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:slash="http://purl.org/rss/1.0/modules/slash/" xmlns:wfw="http://wellformedweb.org/CommentAPI/"><channel><title>Copper wire sandwich promises to solve thermal transport issues in small devices</title><link>/technologies/sensor-technology/b/blog/posts/copper-wire-sandwich-promises-to-solve-thermal-transport-issues-in-small-devices</link><description>The flexible material improves thermal transport within a device. (Image Credit: Carnegie Mellon University, College of Engineering)
Smaller and more powerful devices have a greater risk of overheating and burning out. Although cooling solution tech.</description><dc:language>en-US</dc:language><generator>Telligent Community 12</generator></channel></rss>