AES-ZU7EV-1-SOM-I-G, SOM Module maximum allowable deflection during environmental vibration

I have a customer application for a AES-ZU7EV-1-SOM-I-G, SOM Module that will be exposed to less than 10 minutes of a high vibration load. The vibration environment will induce some amount of deflection onto the CCA and I want to make sure the CCA is adequately supported by my enclosure design to prevent too much deflection. What is the recommended max deflection limit for the CCA to limit any damage to the CCA components and PWB?

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0 dougw 25 days ago

Check IPC-2221 and IPC-2223.

When PCBs are subjected to flex, they often use stiffener plates glued under large chips, so the solder joints don't see excessive stress.
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0 Dan_Szuch 25 days ago in reply to dougw

Hi dougw. Thank you for your reply to my question. Adding stiffeners opposite the critical components seems appropriate for a new design. Any recommendations for ruggedizing existing CCAs that are fairly densely populated like the Avnet AES-ZU7EV-1-SOM-I-G, SOM Module? I am hoping that an Avnet SME or even one of the SOM module designers see my question and have some level of experience with vibration stresses of similar designs to offer some best practices / rules-of-thumb for solder or component stresses limits due to deflection. My original question may have too many variables to provide any meaningful answer.
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0 Dan_Szuch 25 days ago in reply to Dan_Szuch

I will definitely look into IPC-2221 and IPC-2223. Thanks again.
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0 Dan_Szuch 25 days ago in reply to Dan_Szuch

I will definitely look into IPC-2221 and IPC-2223. Thanks again.
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