element14 Community
element14 Community
    Register Log In
  • Site
  • Search
  • Log In Register
  • Community Hub
    Community Hub
    • What's New on element14
    • Feedback and Support
    • Benefits of Membership
    • Personal Blogs
    • Members Area
    • Achievement Levels
  • Learn
    Learn
    • Ask an Expert
    • eBooks
    • element14 presents
    • Learning Center
    • Tech Spotlight
    • STEM Academy
    • Webinars, Training and Events
    • Learning Groups
  • Technologies
    Technologies
    • 3D Printing
    • FPGA
    • Industrial Automation
    • Internet of Things
    • Power & Energy
    • Sensors
    • Technology Groups
  • Challenges & Projects
    Challenges & Projects
    • Design Challenges
    • element14 presents Projects
    • Project14
    • Arduino Projects
    • Raspberry Pi Projects
    • Project Groups
  • Products
    Products
    • Arduino
    • Avnet & Tria Boards Community
    • Dev Tools
    • Manufacturers
    • Multicomp Pro
    • Product Groups
    • Raspberry Pi
    • RoadTests & Reviews
  • About Us
  • Store
    Store
    • Visit Your Store
    • Choose another store...
      • Europe
      •  Austria (German)
      •  Belgium (Dutch, French)
      •  Bulgaria (Bulgarian)
      •  Czech Republic (Czech)
      •  Denmark (Danish)
      •  Estonia (Estonian)
      •  Finland (Finnish)
      •  France (French)
      •  Germany (German)
      •  Hungary (Hungarian)
      •  Ireland
      •  Israel
      •  Italy (Italian)
      •  Latvia (Latvian)
      •  
      •  Lithuania (Lithuanian)
      •  Netherlands (Dutch)
      •  Norway (Norwegian)
      •  Poland (Polish)
      •  Portugal (Portuguese)
      •  Romania (Romanian)
      •  Russia (Russian)
      •  Slovakia (Slovak)
      •  Slovenia (Slovenian)
      •  Spain (Spanish)
      •  Sweden (Swedish)
      •  Switzerland(German, French)
      •  Turkey (Turkish)
      •  United Kingdom
      • Asia Pacific
      •  Australia
      •  China
      •  Hong Kong
      •  India
      • Japan
      •  Korea (Korean)
      •  Malaysia
      •  New Zealand
      •  Philippines
      •  Singapore
      •  Taiwan
      •  Thailand (Thai)
      • Vietnam
      • Americas
      •  Brazil (Portuguese)
      •  Canada
      •  Mexico (Spanish)
      •  United States
      Can't find the country/region you're looking for? Visit our export site or find a local distributor.
  • Translate
  • Profile
  • Settings
Publications
  • Learn
  • More
Publications
Blog LANES Develops a Molybdenite-Graphene “flexible” Flash Memory Prototype
  • Blog
  • Documents
  • Events
  • Files
  • Members
  • Mentions
  • Sub-Groups
  • Tags
  • More
  • Cancel
  • New
Join Publications to participate - click to join for free!
  • Share
  • More
  • Cancel
Group Actions
  • Group RSS
  • More
  • Cancel
Engagement
  • Author Author: Catwell
  • Date Created: 1 Apr 2013 8:01 PM Date Created
  • Views 496 views
  • Likes 0 likes
  • Comments 0 comments
  • research
  • flextronics
  • on_campus
  • memory
  • cabeatwell
  • flash
  • prototyping
  • university
  • flexible_electronics
  • innovation
  • communication
Related
Recommended

LANES Develops a Molybdenite-Graphene “flexible” Flash Memory Prototype

Catwell
Catwell
1 Apr 2013

image

Molybdenite-Graphene flash memory concept and images. (via EPFL & ACS.org)

 

A little over a year ago, a team of researchers from the Laboratory of Nanoscale Electronics and Structures (LANES) at EPFL created the first ever molybdenite chip. The new chip proved to outperform silicon devices and displayed its viability to serve as the future foundation of smaller, more stable, and more efficient processors. In addition to its superior electronic properties, molybdenite mechanical properties allow for the construction of 3-atom thick bendable, flexible electronic devices. Well, we haven’t seen the technology hit the open market quite yet, but a recent development from the same lab has shown once again that silicon’s successors are on the rise: a chip that combines the amazing properties of both molybdenum and graphene on an incredibly capable chip.

 

The benefits of graphene and molybdenite rely mainly on their high electron carrier mobility, allowing electrons to swiftly and efficiently transfer charges along the materials. Graphene is traditionally difficult to manufacture, but with evolving technology, is finding more use. Molybdenite, found as a mineral of molybdenum sulfide, is highly abundant in nature adding to its already-impressive characteristics.

 

The chip designed by LANES takes on a field effect geometrical structure: a thin layer of the molybdenite material is sandwiched in between graphene electrodes. The top layer of graphene is three times thicker than the bottom and is used to store memory by capturing the electric charge that is transferred across the Molybdenite layer. Graphene is chosen as the chip’s electrodes for its superior electron carrier mobility, while molybdenite’s direct band gap semiconductor property allows it to channel electrons with minimal energy use.

 

In addition to the versatile mechanical properties of the previous molybdenite chip, the hybrid flash memory prototype promises even more performance in terms of size, storage capacity, energy use, and flexibility.

 

"Combining these two materials enabled us to make great progress in miniaturization, and also using these transistors we can make flexible nanoelectronic devices," explains Andras Kis, director of LANES lab.

 

We’ve yet to see any sort of commercialization on the molybdenite predecessor, so the immediate future of this technology is once again left uncertain. But, as we strive forward with the hopes of this technology supercharging our world soon enough, one thing's for sure: silicon’s reign as the computing chip champ may soon be coming to an end.

 

C

See more news at:

http://twitter.com/Cabe_e14

  • Sign in to reply
element14 Community

element14 is the first online community specifically for engineers. Connect with your peers and get expert answers to your questions.

  • Members
  • Learn
  • Technologies
  • Challenges & Projects
  • Products
  • Store
  • About Us
  • Feedback & Support
  • FAQs
  • Terms of Use
  • Privacy Policy
  • Legal and Copyright Notices
  • Sitemap
  • Cookies

An Avnet Company © 2025 Premier Farnell Limited. All Rights Reserved.

Premier Farnell Ltd, registered in England and Wales (no 00876412), registered office: Farnell House, Forge Lane, Leeds LS12 2NE.

ICP 备案号 10220084.

Follow element14

  • X
  • Facebook
  • linkedin
  • YouTube