A new family of integrated load switches from Texas Instruments (TI) features wafer chip scale package technology (WCSP).
The new TPX229xx family also boasts a low ON resistance to minimise dropout through switch, compared to other solutions.
TI's ultra-small 0.8mm x 0.8mm WCSP is ten times smaller than conventional solutions, which makes it suitable for space-constrained applications.
Integrated features further reduce external component count complexity, TI claims, while the low quiescent and shutdown currents help to extend the battery life of applications.
TI's new family also feature a low operating voltage range of between 0.9V and 3.6V enabling use in a variety of portable devices.
The company recently announced a new family of digital signal processors targeted at the emerging femtocell market.
TI's new solutions are intended to speed up the development of femtocell products and other HSPA applications, helping original equipment manufacturers to bring reliable devices to market.