Scientists at the University of Illinois suggest this technique would allow strips to be peeled off and printed on to cheaper substrates such as glass or silicon, IEEE Spectrum reports.
They believe this process will make production of components such as transistors cheaper in the future.
However, John Rogers, a materials engineer leading the investigation, pointed out that handling the films is a tricky process given the size of the wafers produced in this research range from a couple of hundred nanometres to only a few micrometres.
Despite this, manufacturers may now have an option when it comes to cost-effective production and purchasing.
"The problem is that compound semiconductors are much more expensive than silicon. A 6-inch wafer of gallium arsenide costs about $200 (£138), whereas a 200-millimeter wafer of silicon goes for roughly $40," the publication noted.
According to its website, the University of Illinois characterises itself as a global leader in research, teaching and public engagement
