Findings from Arizona-based Semico found that the probability of meeting an original target date of 2012 in now remote, but the firm notes that there is clamour among big organisations such as Samsung, Intel and Taiwan Semiconductor to use make the switch.
It is thought by moving over to manufacturing of 450-mm wafers, companies like these produce more chips per die as well as generating increased profits, EE Times Europe reports.
Semico's president Jim Feldhan has predicted that consumer demands for more memory would lead to component makers increasing unit volumes and he suggested that firms would "not stagnate" at the existing 300-mm process.
"The ability to produce chips in a more economical manufacturing environment is good for the overall industry future," he added.
In addition to its research documents, Semico offers "technology roadmaps for end-use markets".
