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Documents US semiconductor firm unveils thermal simulation tool
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  • Author Author: e14news
  • Date Created: 8 Jun 2010 7:16 PM Date Created
  • Last Updated Last Updated: 7 Oct 2021 5:03 AM
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US semiconductor firm unveils thermal simulation tool

US semiconductor manufacturer Vishay has unveiled its new ThermaSim tool that can accelerate time-to-market for designers.

The online MOFSET thermal simulation application is also more efficient, user-friendly and has greater accuracy than its predecessor, according to the company.

It is the first tool of its kind to be created using "finite element analysis" and its components are particularly useful in high-temperature, high-current appliances such as laptop computers, industrial systems and motor vehicles.

The Pennsylvania-based firm, which is the largest producer of discrete semiconductor products in the world, suggested that designers can also apply ThermaSim to any power MOFSET application.

"Simulating these components ensures optimum device selection for application specifications and eliminates fallouts during thermal-performance line testing," the company added.

Vishay also boasts a diverse portfolio of products, including diodes, optoelectronic products and selected integrated circuits as well as inductors and transistors and the organisation has branded itself as a "one-stop shop" offering a variety of parts for specific client demands.ADNFCR-1785-ID-19825809-ADNFCR
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