LED lighting has received extensive attention as a new generation of lighting. Rely solely on the LED package and can not produce good lighting. This article from the electronic circuit, thermal analysis, optical design of how to use the high power led characteristics to explain.
Recent years, with a high density of electronic products, high integration degree, the importance of the thermal solution, LED lighting is no exception, but also need the thermal solution. Although the incandescent and fluorescent lamps, energy loss, but most of the energy through infrared direct radiation out the light, less heat; while the LED strip lights, in addition to the consumption of energy as visible light, other energy conversion into heat. In addition, because the small size of LED packaging, heat dissipation through convection and radiation is less, which has accumulated a lot of heat.
The thermal solution?
Next, consider how the development of thermal solutions. The thermal solution is to solve the various issues that arise because of the heat. Are:
Lead to bending and cracking because of thermal expansion
Electronic circuit run obstacles
(3) material deterioration of the quality
In addition, and a fear that if the heat will not damage equipment? To avoid these problems, to try to control the temperature of electronic equipment that is effective heat dissipation is very important, the focus is on account of the use of the machine environment and installation methods to develop the best thermal solutions. Here are the problems caused by heat. The latter part of the LED Blue 150W lights, for example, the LED-related solutions to explain.
Problems caused by heat
Lead to bending and cracking because of thermal expansion
The electronic equipment consists of multiple parts, each part of the material is not the same thermal expansion and contraction of the scale is not the same. Therefore, when a variety of materials together when it is possible to make the material to bend, expansion, the products in the junction because of excessive stress will lead to cracking.
Electronic circuit run obstacles
In general, the semiconductor element as a heat source, such a feature, that is, when the rising temperature of the semiconductor components in electronic equipment, electrical impedance will be smaller. So it is easy to fall into the "rise in temperature - the impedance drop - current increases - increased heat - the temperature rise in a vicious cycle, and thus prone to blown phenomenon.
3 deterioration of the quality of materials
In general, the materials used in electronic equipment is easily oxidized, the higher temperature oxidation the faster and, if these materials to repeated high-temperature oxidation, it will shorten its life. The same time, the repeated heating, the material many times expansion, repeatedly expand and contract, and will reduce the strength of the material, thus destroying the material.
LED 200W thermal solution
The following LED lights, for example, specific discussion of LED thermal solution.
To avoid heating of the electronic equipment for a variety of ways. For example, add the radiator around the heat source placement can provide air-conditioning fan. The former is by increasing the cooling area, to increase the cooling channel, which is not heat source of the heat gathered around. However, as the generalization shown in Figure 1 LED lights, LED package can not directly connect the radiator did not install the fan position. And the internal power supply circuit board can also generate heat, the heat dissipation problem of LED 400W lights can be said is a very difficult problem. In this way, how to effectively use the LED installation material and the heat sink becomes very important.