LED light source has a number of environmental advantages, but early products in the design of heat treatment and high brightness, there are still some technical bottlenecks could not break through, but under the continuous improvement of the LED chip manufacturing process, the existing lighting with the LED light output lumens more nearly in everyday lighting needs, coupled with the component design of the IC solid form, so that the LED light source designed to add more flexibility and advantages.
LED light source is not easy to damage the long life advantages, Excluding composition, compared to traditional high-energy tungsten (incandescent) / halogen / high pressure sodium, mercury pollution concerns CCFL fluorescent lamps LED performance is quite excellent new choice of alternative light source.
However, in order to different everyday lighting applications, also for the luminous efficiency of light-shaped, thermal design and the overall use of cost and number of applications continued to improve the design of LED products, LED lighting is more practical value, rather than just show the environmental demands of the decorations.
80W high brightness LED with 6,400 to 8,000 lumens brightness, lighting up to 100lm-W, device lifetime over 50,000 hours.
led driver 120w light source, differences in material properties of the component itself, coupled with the light-emitting principle is different from the traditional lighting, light shape if not addressed, and improved lighting quality For light LED to replace the general day-to-day applications, there are still a number of restrictions, CRI illumination shape, color lighting, power conversion efficiency ... key issues need to strengthen through the optical physical design of the chip manufacturing process improvements or fixtures to further meet the needs of the general lighting.
LED solid state lighting is still the problem of high cost
In the actual lighting applications market, LED solid state lighting there are still high-priced, high-cost limit, you want to accelerate the popularity of LED lighting applications in a short period of time, and related businesses still have the cost of components, production technology, validation criteria ... project, one by one to improve cost efficiency.
Production technologies have the final product in the color temperature, color rendering and the photoelectric conversion efficiency to strengthen the specifications and performance improvements, but also to improve the AC-DC power conversion, drive control of high power, light heat and light-processing technology, LED lighting technology, whether the rapid spread of the key.
High-brightness LEDs compared to conventional high-brightness halogen lamps, sodium lamps have a longer service life can be made of outdoor lamps, saving maintenance costs.
Front is also mentioned, LED Flood light 10W must be designed to improve the thermal design of the lighting module, the cooling mechanism of integration is the key to LED lighting products, ability to maintain long life, low light. For example, the use of the COB the LED crystal light board, LED chip above the printed circuit board, LED chips can be directly in contact through the PCB to increase the heat transfer efficiency, thus improving the cooling of the LED lighting applications.
Design in the form of LED carrier board component cooling efficiency can be improved
Due should be high power, the brightness of the lighting application design, the PCB contained version will shift to the metal core PCB material to increase the cooling efficiency of the LED components, because of the heat-driven process, may be the metal core by the PCB reduced thermal resistance, which further enhances the cooling performance.
Metal Core PCB to use more the MCPCB (Metal Core Printed Circuit Board) to reduce the thermal resistance of the carrier board design, MCPCB In order to reduce costs, more choice of aluminum core of the carrier board, with a low-cost, good cooling capacity and better anti-corrosion properties .
LED to obtain the advantages of daily light source of a large number of applications, it is necessary to in-depth development of the core technology of the chip, which affect the LED components luminescence properties, the efficiency of the key technical differences in the substrate material and crystal growth. LED Power Supply substrate material in addition to the conventional sapphire substrate, silicon, silicon carbide, zinc oxide, gallium nitride ... and so are the LED application focus. The thin-film chip technology is a key technology to develop high-brightness LED chips.
Thin film focuses on reducing the grain size of the lateral optical loss, with the bottom of the reflecting surface integration, 97% of the chip itself generated by the electric light output from the LED positive output, to avoid light loss, so naturally can improve the luminous efficiency of LED unit . In addition to improving the electro-optical efficiency of the LED chip, or by changing the chip architecture, such as chip surface roughening, through multiple to improve the electro-optical efficiency process and product improvements.
Use of packaging technology comprehensively enhance the performance of LED components lighting
High power LED packaging technology can be divided into a single chip package, integrated multi-chip package, chip board package ... and other projects through the improvement of packaging technology, you can let the LED Spotlight 30W luminous efficiency, heat dissipation, product reliability comprehensive improvement .
Single-chip packaging applications, can use the package to improve the luminous efficiency, thermal resistance, heat or development of SMT form of production components, another stage in the package but also the use of fluorescent powder mixed with the means of disposing of the package body to improve the color temperature of the LED output or control the LED illumination color and enhance the quality of lighting.
High-brightness LED lighting modules that can be used a single high power LED 30W ~ 120W drive
In addition to the grain itself, process or package designed to improve the design form of the LED lamps with optical lens may apply to the use of optical physical properties to improve product quality. For example, the LED with optical silicone sealant so that components can have a larger illumination beam angle, and after the encapsulation process components can also be used with the second optical lens to strengthen the design of the form of the bottom of the reflector cup, has significantly strengthened the optical characteristics of LED components.
Using a large number of LED components using planar arrangement in the form of a number of high-brightness LED lighting design, but also the number to increase the effect of lamp light output on the LED component packages by the same token, multiple LED Floodlight 80W chips 1 package carrier board the plane, is also a common design for LED lighting applications.