The SMT Hybrid packaging international exhibition was going on side by side to PCIM 2018 so I had a chance to discover never seen before new stuff going on in production and manufacturing side of electronics pcb process. The high level of automation from Hitachi and Mitsubishi were mind-boggling. To be honest, I had never paid much attention to this side of the world.
Link: SMT Hybrid Packaging Messe 2018
They presented a whole assembly line where one only has to enter the pcb and the whole process from placement, alignment, assembling, cleaning and drying was automated.
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