Hello...Viewing the Zynq-7000 SoC PCB Design Guide (UG933) the following statement is made:
"PCB and package delay skew for SD_DAT[0:3] and SD_CMD relative to SD_CLK must be between 50–200 ps"
I am designing a carrier board for the Avnet UltraZed EV SOM that will have a micro SD card holder. Can someone interpret the Xilinx layout advice for me? I assume the SD_DATA and SD_CMD traces should be matched in length (ie trace plus package delay) but I cannot determine what Xilinx means in reference to the SD_CLK signal. Are they saying the SD_CLK should be delayed 50-200 pS relative to the other traces or the SD_CLK should lead those traces by 50-200 pS? Something else entirely? Hopefully someone out there has done a successful layout and figured this out. Any help is appreciated. Thanks!