The MicroZed Industrial IoT Bundle is a development system built around the Xilinx Zynq-7000 All Programmable SoC. It includes dual-core ARM A9s, 1GB of DDR3 memory, 10/100/1000 Ethernet, and integrated FPGA fabric. The platform integrates with Amazon FreeRTOS to provide a powerful heterogenous Industrial IoT platform capable of executing mixed criticality applications such as complex motor control in the FPGA and IoT connectivity via the processing subsystem.
Documentation and Design Files
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Key Features
- STMicroelectronics Sensor Shield includes
- LSM6DS0: MEMS 3D accelerometer (±2/±4/±8 g) + 3D gyroscope (±245/±500/±2000 dps)
- LIS3MDL: MEMS 3D magnetometer (±4/ ±8/ ±12/ 16 gauss)
- LPS25HB*: MEMS pressure sensor, 260-1260 hPa absolute digital output barometer
- HTS221: capacitive digital relative humidity and temperature
- DIL 24-pin socket available for additional MEMS adapters and other sensors (UV index)
- Maxim Integrated Thermocouple Sensor
- Converts Output of a K-Type Thermocouple Directly to a Signed 14-Bit Digital Word
- Cold-Junction Compensation
- 14-Bit, 0.25°C Resolution
- Detects Thermocouple Shorts to GND or VCC
- Detects Open Thermocouple
- 6-Pin Pmod-Compatible Connector (SPI)
- Production ready, MidcroZed 7010 SOM
- Based on Xilinx Zynq-7000 SoC
- Dual ARM
Cortex
-A9 processing system - FPGA logic
- Expandable development platform
- R3 Arduino-compatible shield expansion slot
- Two 2x6 peripheral module expansion slots
- Additional user header providing access to SPI, I2C, UART, and GPIO on MicroZe
- Pluggable sensor options
- ST Microelectronics motion MEMS and environmental sensor shield
- Connects to shield site
- Six I2C based sensor solutions
- 3-axis accelerometer + 3-axis gyroscope
- 3-axis magnetometer
- Humidity and temperature
- Pressure
- Connectivity
- 10/100/1000 Ethernet Port
- Optional WILINK8 WiFi/BLE add-on
PRODUCT BRIEFS
