Hello,
I can't figure out how to get my tstop layer to take same shape as my polygon. I'm trying to create a heat sink area beneath a DPAK device. I was able to get the polygon, top layer to take proper shape by naming it same as grnd pad on device, adding a via, and connecting it to ground, then "ratsnest." But none of that seems to be available for the tstop layer. I don't want the parts of other vias and traces to have their copper exposed. For example in the picture the P1 trace and it's via inside the polygon area would have the copper exposed rather than masked.
Can someone help?