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Documents 3M Electronics Assembly Solutions: Specialty Products for Thermal Management Applications
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  • Author Author: jmtmason
  • Date Created: 28 Oct 2010 8:16 AM Date Created
  • Last Updated Last Updated: 8 Oct 2021 2:32 AM
  • Views 660 views
  • Likes 1 like
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3M Electronics Assembly Solutions: Specialty Products for Thermal Management Applications

3MTm Thermally Conductive Interface Pads: Silicone or Acrylic Elastomers

3MTm Hyper-Soft Thermally Conductive Interface Pads are used to transfer heat from a hot surface or device to a coller surface region of the assembled design. The 3M Thermally Conductive pads are available in a silicone elastomer version or an acrylic elastomer version where a non-silicone base material is desired. the pads are designed in a variety of thermal conductivities and softness grades to priovide excellent gap filling, low assembled stress and a high degree of wet-out for more efficient heat trannsfer.

 

3MTm Thermally Conductive Epoxies

This range of liquid adhesives has minimal odor and superior structural adhesion strength. Dispensing is easy for high output, in-line automated manufacturing and manual application Adhesive flows and fills micro-spaces on surfaces. Ultra-thin bond line helps achieve low thermal impedance.

 

3MTm Thermally Conductive Adhesive Transfer Tapes

This range of high adhesion thin taps offers efficient thermal transfer for a wide range of applications requiring a thermal management solution: bonding heat shrinks, heat spreaders and other cooling devices to IC packages, power transistors, and other heat generating components. Each tape combines 3M high performance acrylic adhesive with highly conductive ceramic particles for an extremely reliable and user-friendly thermal interface. Highly conformable construction provides excellent wet-out on surfaces.

 

3MTm Thermally Conductive Grease

The 3MTm Thermally Conductive Greases are high performance thermal interface materials for transferring thermal energy from a heat source (e.g. processor chip, graphics chip, High Power LED) to a heat sink. The proprietary blend of inorganic fillers contained in an organic matrix (non-silicone) ensures high thermal conductivity and low thermal resistance. Grease products are available in two versions: Standard viscosity and a lower viscosity version that can be useful in screen printing application methods.

 

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Attachments:
imageThermal Management Solutions for Electronics Brochure - Brochure.pdf
imageTCATT.pdf
imageHigher Frequencies Leading to Rising Power and EMI in Traditionally Low Power Electronic Devices Technical Article.pdf
imageElectronics Assembly Solutions brochure new.pdf
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