Heat-bondable, Z-Axis conductive films, consisting of thermoplastic and themosetadhesives randomly loaded with conductive particles. These particles allow interconnection of circuit lines through the adhesive thickness (the Z-Axis), but are spaced far enough apart for the product to be electrically insulating along the plane of the adhesive.
PCB Grounding Plane Bonding Film
3M
Grounded Heat Shrink Bonding Film 7373 is an anisotropic electrically-conductive thermoset adhesive film, ideal for bonding and grounding high frequency printed circuit boards, such as cellular base station amplifiers to heat shrinks and heat spreaders. Eliminates the need for mechanical fasteners! This product is not halogen-compliant.
Product: 7373
Adhesive Type: Epoxy/acrylate
Contact Resistance: 1.0 m, 3M Test Method
Thermal Impedance: 0.5°C-in²/W
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