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Not-fitted components visible on the paste layers

obywatel_lk

Hello,

The PCB company called  me and that they have an issue. I have a PCB with variant that goes to manufacture a stencil. In a variant view I don't see components in 3D view and that is OK. I see them on top paste layer. Bom is correct - no not fitted components. Pick and place files are OK.

Here is a 3D view:

image

Here is a top paste layer:

image

I have "hide not fitted components option" checked

image

I have a variant ON:

image

I'm generating outputs with variants:

image

I have all components matched:

image

No warnings, no errors.

Could you tell me what is wrong and if it is a CircuitStudio bug?

  • What did the PCB company say their issue was?

    Also, if those circular pads are for probing with a multimeter, test fixture, etc. I'd recommend removing their paste. Solder paste has flux in it that can leave a hard nonconductive coating over solder joints which makes it difficult to probe.

  • in reply to GabeFromSpace

    Hello Gabriel,

    Thanks for quick answer. They saw a paste on test points - and there should be no paste so good catch. My issue is, that the paste is on the all not fitted components (top paste / bottom paste layer), so they almost manufactured a stencil with all components (Even these not fitted) despite the variant is correctly turned on and gerber files are generated specifically for this variant.

  • in reply to obywatel_lk

    I have seen in various PCBs that there's paste in the DNP footprints, it doesn't hurt having paste in the pads and if in the future you want to populate a part the paste is already there. Removing the paste from the DNPs would require another stencil, having paste in all the pads only need one stencil.

  • in reply to obywatel_lk

    Like Charlieo said, putting solder paste on DNP components shouldn't hurt. With my footprint library, solder paste of choice, and stencil preferences, an 0603 takes less than $0.00045 worth of solder paste. Not really something to worry about unless you have dozens of DNPs & you're making tens of thousands of boards.

    For the test points, everybody has their unique design & library preferences. But I generally make a "test point" library component to put in the schematics, then I set the "Paste Mask Expansion" on the pad in the footprint to -10mm, so it effectively gets rid of the paste layer.

  • Thank you for all replies. I created a pad class for all unwanted pads and removed the paste by adding a clearance in "Past Mask Expansion Rule". The question is whether this is the intended implementation of the functionality (?)