The explosion of data generation, the rise of AI/ML applications, and the ongoing evolution of cloud and edge computing are rapidly transforming the technology landscape. These shifts place new demands on the underlying infrastructure—particularly server storage interconnects—where Amphenol Communications Solutions (ACS) and its Server Storage IO (SSIO) business unit play a leading role.
With a broad product lineup optimized for high-speed signaling, dense configurations, and thermal efficiency—ranging from PCIe Gen6 Mini Cool Edge, COM-HPC Compression Connectors, to DDR5/LPDDR5 CAMM2 Connectors—SSIO is well-positioned to support the next decade of intelligent computing.
Application Focus: Where SSIO Solutions Matter Most
Data Centers & Hyperscale Infrastructure
Modern data centers require ultra-low latency, high-throughput performance to power cloud computing, virtualization, and data services. Interconnects must deliver both speed and efficiency while maintaining mechanical reliability in high-density server environments.
SSIO Advantage:
- Double Density Cool Edge 0.80mm CN and COM-HPC Compression Connectors provide compact, high-speed backplane connectivity ideal for modular server designs.
- PCIe Gen6 Mini Cool Edge 0.60mm CN supports 64 GT/s signaling in tight spaces, meeting performance and layout constraints of next-gen platforms.
- SAS PCIe connectors ensure fast, redundant storage access in scale-out architectures.
AI/ML Training and Inference Systems
Training large-scale models and running inference workloads demand exceptional memory bandwidth, high-speed I/O between accelerators, and system scalability. High-wattage environments also introduce thermal and space challenges.
SSIO Advantage:
- Hyper Cool Edge supports dense GPU node interconnects with optimized airflow and thermal handling.
- Cool Express Link delivers high-speed connectivity in accelerator and switch-heavy compute environments.
- DDR5/LPDDR5 CAMM2 CN and DDR5 287pins sockets offer high-capacity, high-speed memory support essential for large-scale model training.
- PCI Express Flip CEM Card Edge Connectors provide reliable GPU interconnects for AI/ML clusters.
Enterprise and Cloud Storage
Storage systems must scale seamlessly to support NVMe, SAS, and PCIe storage, while balancing redundancy and performance.
SSIO Advantage:
- SAS PCIe connectors offer fast data transfer and redundancy in RAID and JBOD systems.
- PCIe M.2 Gen 5 Card Edge Connectors enable Gen5/Gen6 SSD connectivity in compact, hot-swappable form factors.
- Double Density Cool Edge IO supports scalable high-speed backplanes for dense storage blades.
- 40mm BtB Connectors (40pos) enable mezzanine connections for storage controller cards with tight packaging requirements.
Edge AI and Micro Data Centers
Edge environments demand compute performance in small, ruggedized packages. Interconnects must support thermal efficiency and mechanical robustness in non-traditional data center conditions.
SSIO Advantage:
- Mini Cool Edge Connectors and PCIe Gen6 Mini Cool Edge IO enable compact, high-speed I/O in embedded or mobile edge systems.
- Compression Mount Connectors such as COM-HPC reduce assembly complexity and improve serviceability in constrained designs.
- 40mm BtB Connectors support vertical or board-stacking configurations with minimal footprint.
Emerging and Future Trends: Where Infrastructure is Headed
- AI Model Scaling and AI-as-a-Service (AIaaS)
The rapid expansion of AI workloads—especially generative AI, large language models (LLMs), and multi-modal AI—demands more from server and storage infrastructure than ever before. These systems must accommodate thousands of GPUs, ultra-fast interconnects, and extremely high memory bandwidth, all while maintaining thermal efficiency. AI-as-a-Service platforms are scaling globally, increasing demand for modular, dense compute clusters capable of supporting massive concurrent workloads with low latency and high availability.
How SSIO Supports This:
- Hyper Cool Edge IO enables dense GPU-to-GPU interconnects with built-in airflow optimization.
- Double Density Cool Edge IO allows more channels per slot, optimizing rack-space efficiency.
- Cool Express Link ensures stable, high-speed data paths between CPUs and accelerators.
- DDR5/LPDDR5 CAMM2 CN delivers scalable, compact memory solutions for training nodes.
- PCIe Gen6 Flip CEM and Mini Cool Edge 0.60mm CN connectors provide consistent signal integrity in GPU riser and board-to-board applications.
- Transition to PCIe Gen6 and 224G Signaling
As compute and storage architectures transition to PCIe Gen6—and eventually 224G signaling—engineers must address increasingly stringent requirements for channel performance, signal integrity, and form factor flexibility. With 64 GT/s signaling, Gen6 offers double the bandwidth of Gen5, but also introduces tighter tolerances for loss budgets, board routing, and connector quality. Designers must now balance performance with manufacturability, density, and backward compatibility.
How SSIO Supports This:
- PCIe Gen6 Mini Cool Edge IO and Mini Cool Edge 0.60mm CN are tuned for 64 GT/s and compact designs.
- PCIe M.2 Gen 5 Card Edge Connectors provide SSD interface support while maintaining Gen5/Gen6 compatibility.
- Flip CEM Connectors ensure rugged, reliable PCIe Gen6 riser card connections in high-speed environments.
- Signal integrity optimizations across all SSIO Gen6-ready connectors help maintain eye diagram performance in longer or routed channels.
- Memory Bandwidth Bottlenecks and DDR5 Transition
High-speed memory is now a central enabler of performance in AI, big data analytics, and cloud services. DDR5 offers significantly higher bandwidth, more efficient power delivery, and higher DIMM capacities compared to DDR4, helping alleviate the memory bottleneck across compute-intensive environments. As servers transition to DDR5 and CAMM2-based modules, connector design becomes a critical factor in system reliability and scalability.
How SSIO Supports This:
- DDR5 DIMM and RIMM sockets support faster speeds (up to 6400 MT/s) and new power management features.
- DDR5 287pins sockets deliver higher contact density in traditional server layouts.
- CAMM2 connectors provide a compact, high-capacity memory interface ideal for AI/ML systems and thin form factor boards.
- Mechanical design supports thermal and vibrational stability in dual-socket or multi-DIMM setups.
- Edge AI and Micro Data Centers
The movement of compute closer to the edge—to support latency-sensitive workloads such as real-time video analytics, robotics, and IoT—requires ruggedized, space-efficient platforms. These micro data centers and edge servers must be thermally self-sufficient, compact, and mechanically robust, while still delivering high-speed processing and I/O performance in challenging environments.
How SSIO Supports This:
- Mini Cool Edge IO and Mini Cool Edge 0.60mm CN connectors deliver Gen6 speed in compact form factors.
- COM-HPC Compression Connectors simplify serviceability and enable modularity in space-constrained designs.
- 40mm BtB connectors facilitate stackable, low-profile designs for board-level integration.
- Flip CEM connectors enhance signal routing in systems with vertical GPU or accelerator mounts.
- Sustainable Data Centers and Circular Compute Design
As enterprises and hyperscalers strive to meet aggressive sustainability goals, server architectures are evolving to support modularity, energy efficiency, and long-term serviceability. Circular compute principles—modular upgrades, hardware reuse, and efficient thermal management—are driving demand for interconnects that support high-density signals in small, hot-swappable formats, with optimal airflow and power handling.
How SSIO Supports This:
- Double Density Cool Edge IO maximizes I/O throughput in minimal space, reducing overall system footprint.
- Hot-swappable compression connectors, including COM-HPC, enable modularity and long-term reusability.
- Airflow-aware product designs, such as Hyper Cool Edge, optimize cooling performance across high-wattage racks.
- Low-loss, high-density interconnects allow for fewer connectors per system, lowering power draw and simplifying design.
SSIO Product Recap: Built for the Next Frontier
|
Product |
Use Case |
Key Features |
|
PCIe Gen6 Mini Cool Edge IO |
High-speed compute, edge AI |
64 GT/s, compact size, vertical or right-angle configuration |
|
PCIe M.2 Gen 5 Card Edge Connectors |
SSD/NVMe storage |
Gen5/Gen6 capable, small form factor, rugged insertion cycles |
|
DDR5/LPDDR5 CAMM2 CN |
AI training memory platforms |
High-density, compact, scalable memory interconnect |
|
Hyper Cool Edge IO |
GPU clusters, thermal-intensive systems |
High-density, enhanced thermal support, 112G+ ready |
|
Flip CEM PCIe Connectors |
GPU riser, accelerator boards |
Gen6 capable, secure mating, robust mechanical fit |
|
Cool Express Link |
Switch cards, backplanes |
Signal integrity optimized for AI/ML data path reliability |
|
COM-HPC Compression Connectors |
Modular edge designs |
Compression mount, tool-less serviceability, rugged retention |
|
Double Density Cool Edge IO (0.80mm CN) |
Storage blades, cloud I/O |
2x density, airflow design, compact footprint |
|
SAS PCIe Connectors |
Enterprise storage, RAID |
High-reliability, fast access, hot-pluggable |
|
0.40mm BtB Connectors (40pos) |
Vertical stacking, edge computing |
Ultra-compact, vibration resistant, ideal for mezzanine designs |
|
DDR5 287pins |
Traditional server motherboards |
High-density, ECC and PMIC support |
Conclusion: Empowering the Data-Driven Era
From hyperscale compute to edge AI and enterprise storage, Amphenol CS’s SSIO business unit delivers interconnect solutions that are ready to meet the growing complexity of next-generation platforms. With industry-aligned product development and distribution support, SSIO helps designers build systems that are faster, cooler, denser, and more reliable than ever before.
- Explore Amphenol SSIO Solutions on Amphenol-CS.com
- Server & Storage Brochure