As data speeds increase and system designs become more compact, engineers face growing challenges in maintaining signal integrity and scalability. Amphenol's PCIe Gen 7 Mini Cool Edge IO Connector answers the call with a compact, high-performance solution that extends reach, reduces complexity, and future-proofs high-speed architectures beyond the limits of conventional PCB routing.
Push Performance Boundaries with PCIe® Gen 7 Speeds
Supporting up to 128G PAM4 and PCIe® Gen 7, this high-speed connector allows over 1.0 meter of transmission distance without compromising signal integrity. It’s ideal for high-density applications where maintaining performance over long distances is critical.
Design Smarter with a Compact, Dual-Use Connector
The Mini Cool Edge IO Connector features a 0.60mm pitch and supports both vertical and right-angle configurations, enabling design flexibility for space-constrained environments. Its dual-application capability (cable and card edge) reduces BOM complexity and improves modularity — ideal for next-gen system architectures.
Technical Features That Deliver Value
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PCIe® Gen 7 and 128G PAM4 support – Handles ultra-high-speed data for next-generation applications
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Over 1.0 meter transmission range – Maintains signal integrity far beyond traditional PCB traces
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85Ω impedance – Ensures optimal signal quality and protocol compliance
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Various pin count options – Adapts to diverse system requirements
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Supports PCIe®, NVMe, and SAS protocols – Ensures broad compatibility across platforms
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Cable-to-card edge dual application – Enhances flexibility and simplifies upgrades
Conclusion
The PCIe Gen 7 Mini Cool Edge IO Connector from Amphenol is purpose-built for engineers tackling high-speed challenges in compact system designs. With support for up to 128G PAM4, over 1-meter reach, and dual cable/card edge compatibility, it simplifies routing, enhances signal integrity, and reduces system complexity. If you’re designing for PCIe® Gen 7 and beyond, this connector provides the performance, scalability, and modularity needed for next-generation platforms.