With their ability to drastically simplify provision of low-power isolated power rails that are commonly required in applications such as process control and industrial
communications interfaces, encapsulated though-hole DC/DC converters became immensely popular following their introduction more than two decades ago. The
available range of input and output voltages quickly evolved to reflect the commonest industrial levels, leaving the migration to surface-mount packages as the
most noticeable change to the original product’s concept. New developments are taking SMT packaging to a higher level.
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