Hi All,
Please may we tell you about the IIS3DWB10IS.
Ultrawide bandwidth, low-noise, 3-axis digital vibration sensor with ISPU - intelligent sensor processing unit
The IIS3DWB10IS is a 3-axis digital vibration sensor that, for the first time, brings piezoelectric-class performance to a MEMS device: flat frequency response from DC to above 10 kHz, selectable full scale of ±50/±100/±200 g, and noise density down to 35 µg/√Hz. Unlike a piezo element, it needs no external analog front-end, ADC, or conditioning chain — one digital component in a 4.5 × 4.5 × 1.5 mm LGA package with wettable flanks.
The embedded ISPU 2.0 (intelligent sensor processing unit) is a C-programmable 40 MIPS / 40 MFLOPS core with FPU that runs FFT, filtering, envelope detection, and AI-based anomaly detection directly inside the sensor, before any host MCU is involved — enabling battery-operated wireless sensor nodes. SPI/I3C interface, external clock sync for sensor arrays, −40 to +125 °C, and ST’s 10-year industrial longevity commitment. Available in volume from July 2026.
Please visit Farnell here: IIS3DWB10ISTR STMICROELECTRONICS, MEMS Accelerometer, ± 50g, ±100g | Farnell® UK
Visit us here: IIS3DWB10IS | Product - STMicroelectronics
Thanks Em.