New product:TE Connectivity Introduces Three Fine-Pitch Board-to-Board Connectors for IoT, Smartphones and Wearable Devices
Do you have questions on any TE / AMP brand product? Ask me!
I am here to answer any questions you may have on TE and AMP brand products.
TE Connectivity (TE) today introduced three new board-to-board (BTB) connectors, including the 0.4 mm fine-pitch EMI (electromagnetic interference) shielded board-to-FPC (flexible printed circuit) connector, 0.4 mm pitch board-to-board connector and 0.35 mm pitch board-to-board connector with a locking peg design.
Product Features
- 0.35mm and 0.4mm centerline
- 10 to 60 positions available for usage
- Stacking height ranges from 0.5mm (BTF) to 0.98mm
- Width ranges from 1.85mm to 2.98mm
Applications
- Wearables
- Mobile Phones
- Tablet PCs
- Mobile Media Players
- Ultraportable Devices
- Notebooks
Documentation & Additional Information
TE Connectivity (TE), a world leader in connectivity, today introduced three new board-to-board (BTB) connectors, including the 0.4 mm fine-pitch EMI (electromagnetic interference) shielded board-to-FPC (flexible printed circuit) connector, 0.4 mm pitch board-to-board connector and 0.35 mm pitch board-to-board connector with a locking peg design — new additions to its board-to-board product portfolio for Internet of Things (IoT), smartphones, wearables and other mobile devices. These three products are designed to address the smartphone manufacturers’ requirements for a super-slim, low-profile BTB solution.
“Our 0.4 mm fine-pitch EMI shielded board-to-FPC connector utilizes a unique spring contact and latching shield to enable a lower profile and smaller footprint than traditional FPC solutions,” said Eric Himelright, vice president of product management, TE Consumer Devices. “Its unique design with locking shield helps our customers lower the overall profile height of their devices, simplify their reliability testing and mitigate EMI concerns.”
“The other two new BTB connectors ensure contact reliability with a multiple contact-point system and a contact self-lock concept,” Himelright added. “These three connectors help secure higher density in limited spaces.”
Other key features and benefits of the three board-to-board connectors include:
• The 0.4 mm fine-pitch EMI shielded board-to-FPC connector is 0.9 mm high, which includes a receptacle connector (0.52 mm), an FPC (0.08 mm) and a stiffener plate (0.3 mm), and has an innovative design to make the mating operations easier and to also facilitate visual inspection of properly mated connectors.
• The 0.4 mm pitch board-to-board connector is 2.5 mm wide and 0.7 mm high and has a robust body structure to reduce breakage problems.
• The 0.35 mm pitch board-to-board connector with a locking peg design is 1.85 mm wide and 0.6 mm high, provides a stronger retention force by applying a new peg locking system and improves the robust connector structure with uniquely-shaped locking pegs.
Additional information on these three TE board-to-board connectors can be found at www.te.com/products/fpbtbPR.