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Documents QSFP/QSFP+ (Quad Small Form Factor Pluggable) Connectors by TE Connectivity
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  • Author Author: sanderjwitteveen
  • Date Created: 4 Nov 2013 10:37 AM Date Created
  • Last Updated Last Updated: 8 Oct 2021 7:46 AM
  • Views 1008 views
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Recommended

QSFP/QSFP+ (Quad Small Form Factor Pluggable) Connectors by TE Connectivity

Upgrading current backplane architectures from existing to higher performance designs is a continual challenge in the interconnect industry. We are addressing this issue with its Z-PACK HM-Zd connector family with the introduction of the Z-PACK HM-Zd Plus connector. The new Z-PACK HM-Zd Plus product is ideally suited to meet next generation AdvancedTCA designs.

The Z-PACK HM-Zd Plus connector is fully compatible with existing Z-PACK HM-Zd connectors, but offers an increase in data rate performance to 15 - 20 Gb/s. Enabling this performance upgrade are a reduction in connector and pcb footprint crosstalk, tighter impedance control, reduction of intra pair skew and an improvement in the insertion loss characteristics. All of this is achieved in a form factor that is identical to the current industry standard version and therefore fully backward compatible with existing legacy equipment in the field today.

As exemplified by the Z-PACK HM-Zd Plus connector development effort, we are committed to meeting customer needs as requirements for increased interconnect performance intensify, not only with brand new, state-of-the-art designs but with enhanced versions of existing connector families as well.

 

Key Features

  • 15 - 20 Gb/s performance
  • Fully plug compatible with current Z-PACK HM-Zd backplane connector configurations
  • Connector upgrade including reduced crosstalk and skew, tighter impedance control, and improved signal throughput
  • Ideal for next generation AdvancedTCA designs
  • PCB footprint enhanced for lower crosstalk and improved impedance while permitting easier trace routing

 

 

Applications

    • Z-PACK HM-Zd Plus connectors are designed for high speed backplane applications:
    • Servers: Blade, Rack Mount and Mainframe
    • Switches: Stackable, Carrier Grade, Core, Edge and Metro Ethernet
    • Routers: Edge, Core, Enterprise Class, Carrier Grade Ethernet, Broadband Remote access Aggregation Server (BRAS), and Multi Service Edge
    • Optical Transport: Carrier Grade Optical, Metro Wave Division Multi-plexing (WDM), Optical Multi-Service Provisioning, Long Haul Optical, and Optical Line Terminals (OLT)

 

 

For further information about the products please contact our Product Information Center (PIC)

image 2013 Tyco Electronics Corporation, a TE Connectivity Ltd. Company. All Rights Reserved.

TE Connectivity and TE connectivity (logo) are trademarks

Attachments:
Electrical Test report Z-Pack HM-Zd Plus Connector.pdfElectrical Test report Z-Pack HM-Zd Plus Connector.pdf
imageQuick Reference Guide High Speed Backplane interconnect solutions.pdf
imageIntroducing the Z-Pack HM-Zd Plus Connector.pdf
imageHM Zd Plus PresentationFinal.pdf
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