MULTIGIG RT product is a backplane interconnect  family that offers levels of flexibility and customization never before seen in  the industry. This printed circuit based, pinless, interconnect family is  comprised of modular components which can be used in a variety of combinations.  The connectors in this innovatively flexible platform can be combined to provide  the density, data throughput, and signal integrity required for any application  in today's computer, communications, military, medical, or industrial control  industries. The use of printed circuit wafers in this connector system allows  for cost effective sequencing and electrical customization of the connector.  Wafers can be manufactured specifically for differential or signal ended  performance and the impedance, propagation delay, and crosstalk of the connector  can be altered per customer requirements. This scalable board to backplane  connector family is a robust, "pinless" design which eliminates the pin field on  backplane boards and reduces the end user's exposure to field failure in card  cage systems. The MULTIGIG RT connector family is designed specifically for  20.30mm [.800] or 25.40mm [1.00] card pitch systems.
 

• MULTIGIG RT 1 Connector – 141 signals/inch, data rates up to 3.125 Gb/s
• MULTIGIG RT  2 Connector – 113 signals/inch, data rates of 3.125 Gb/s to 6.4+ Gb/s and has been demonstrated to support 10 Gb/s
     

APPLICATIONS

• Military
• Aerospace and defense
• Telecommunications equipment
  • Metro Optical networking equipment
  • SONET switched platforms
  • Aggregation switches
• Midrange servers
• High end servers
• High-speed custom platforms
• Mass data storage
• Rugged, mission-critical applications
• Switches
• Servers/Blade Servers
• Routers
• Storage
     

KEY FEATURES

• Customizable impedance matched printed circuit wafer interface
• Inverse sex backplane connector system with “pinless” interface
• Superior crosstalk performance
• Optimized footprints for signal integrity and ease of board design
• Utilizes a 0.56 [.022] diameter via for lower cost board fabrication
• Three levels of signal contact sequencing
• Telcordia/Bellcore compliant
• Available in modular or monoblock style
• Available for 20.30mm [0.8] or 25.40mm [1.0] card pitch systems
• Durability rated for 200 Cycles
• Fully compatible with MP based fiber optic array interconnects
• Complete connector family includes
  • Power Modules => Maximize Amps/inch density, voltages in pairs
  • Guidance Modules
    • Die cast for strength
    • Optional ESD contact
    • Three sequence levels
    • Pressfit or hardware mounted
    • Backplane drill pattern enabled keying