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Questions about via-in-pad technology

Twilight-peng

Hello!

I'm new member of this community. Recently, I'm designing a compact RF module with a fine-pitch BGA. Thinking of using via-in-pad for space reasons, especially since some PCB manufacturers now offers it for free. So I want get some advice about it. Does anyone have experience with this? Are there any performance or DFM issues I should watch out for?

Thanks for any help

 

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    If you do via-in-pad under a BGA, ensure the vias are filled, otherwise they can wick the solder balls and leave insufficient solder at the connection. Ask the manufacturer what geometry they prefer because there are often tradeoffs - some prefer larger drills, some prefer larger pads and thinner traces than normal design rules, some prefer thicker traces and thinner spaces than normal design rules. Also ask them what yield they expect with the chosen geometry. 

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    If you do via-in-pad under a BGA, ensure the vias are filled, otherwise they can wick the solder balls and leave insufficient solder at the connection. Ask the manufacturer what geometry they prefer because there are often tradeoffs - some prefer larger drills, some prefer larger pads and thinner traces than normal design rules, some prefer thicker traces and thinner spaces than normal design rules. Also ask them what yield they expect with the chosen geometry. 

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