TI LDC1614 Evaluation Module

Table of contents

LDC1614EVM Description

The LDC1614 Evaluation ModuleLDC1614 Evaluation Module demonstrates the use of inductive sensing technology to sense and measure the presence, position or composition of a conductive target object. The module includes two example PCB sensor coils that connect to the four channels of the LDC1614. An MSP430 microcontroller is used to interface the LDC to a host computer.

This module is designed to provide the user with maximum flexibility for system prototyping. It is perforated at two locations: one, between the PCB sensor coil (LC tank) and the LDC1614, and another, between the LDC1614 and the MSP430 interface. The first perforation gives the user the option to snap off the PCB coils from the module and experiment with custom sensor coils. The second perforation allows the user to connect the LDC1614 and sensor coils to a different microcontroller system or use multiple such sensors in one system.

An accompanying GUI allows for maximum flexibility and quick system prototyping.

Features

  • Multiple board perforations: provide maximum evaluation and system design flexibility
  • Includes example sensor coils for the different channels
  • Operates via PC
  • Accompanying GUI for quick concept demonstration and data capture
  • EVM design accelerates prototyping of end application

 

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