TI Multi-Node IoT Bundle Roadtest

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MSP-EXP430FR5969 LaunchPad MSP-EXP430FR5969 LaunchPad

Description

The MSP-EXP430FR5969 LaunchPad Development Kit is an easy-to-use microcontroller development board for the MSP430FR5969 MCU. It contains everything needed to start developing quickly on the MSP430FRxx FRAM platform, including on-board emulation for programming, debugging and Energy Measurements. The board features on-board buttons and LEDs for integration of a simple user interface as well as a SuperCap allowing standalone applications without external power supply. The MSP430FR5969 microcontroller features embedded FRAM (Ferroelectric Random Access Memory), a non-volatile memory known for its ultra-low power, high endurance and high-speed write capabilities. Rapid prototyping is a snap thanks to 20-pin headers and a wide range of BoosterPack plug-in modules enabling technologies such as wireless connectivity, graphical displays, environmental sensing, and much more.

 

Features

  • MSP430 ULP FRAM technology based MSP430FR5969 16-bit MCU
    • 64KB FRAM / 2KB SRAM
    • 16-Bit RISC Architecture up to 8-MHz FRAM access/ 16MHz system clock speed
    • 5x Timer Blocks
    • Analog: 16Ch 12-Bit differential ADC, 16Ch Comparator
    • Digital: AES256, CRC, DMA, HW MPY32
  • EnergyTrace+[CPU State]+[Peripheral State] available for ultra-low-power debugging
  • 20 pin LaunchPad standard leveraging the BoosterPack ecosystem
  • 0.1F SuperCap for standalone power
  • Onboard eZ-FET emulation
  • 2 buttons and 2 LEDs for User Interaction
  • Back-channel UART via USB to PC

 

 

TI CC3200 LaunchPad Wi FiTI CC3200 LaunchPad Wi Fi

Description

 

The SimpleLink™ Wi-Fi® CC3200 LaunchPad (with QFN-packaged device) is an evaluation development platform for the CC3200 wireless microcontroller (MCU), the industry’s first single-chip programmable MCU with built-in Wi-Fi connectivity.  The board features on-board emulation using FTDI and includes sensors for a full out-of-the-box experience. This board can be directly connected to a PC for use with development tools such as CCS and IAR.

 

Features

 

  • CC3200 Wi-Fi wireless microcontroller (MCU) in QFN package
  • Industry’s first devices to be Wi-Fi CERTIFIED™ at the chip level by the Wi-Fi Alliance™
  • USB interface to PC for CCS/IAR using FTDI USB drivers
  • Flash update over the USB using SimpleLink Programmer
  • 2 20-pin connectors enables compatibility with BoosterPacks with added functions (BoosterPack headers)
  • Standalone development platform featuring sensors, LEDs and push-buttons
  • Power from USB for the LaunchPad as well as external BoosterPack
  • Operates from 2 AA alkaline batteries
  • On-board antenna and U.FL connector selectable using a capacitor re-work
  • Supports 4 wire JTAG and 2 Wire SWD
  • GNU Debugger (GDB) support over Open On chip debugger (OpenOCD)

 

TI CC110L RF BoosterPackTI CC110L RF BoosterPack

Description

The CC110L RF BoosterPack is a low-power wireless transceiver extension kit for use with the Texas Instruments MSP-EXP430G2 LaunchPad development kit. Based on the CC110L device, the on-board Anaren Integrated Radio (AIR) A110LR09A radio module with integrated antenna operates in the European 868-870MHz and US 902-928MHz ISM bands. The included software application, called AIR BoosterStack, demonstrates an example sensor network as well as network status reporting.

Features

CC110L RF BoosterPack Hardware Features:

  • 1.8 to 3.6 V operation
  • Low power consumption
  • SPI interface between RF module and MSP430
  • Prototyping area
  • Footprints for adding a microcontroller, pushbutton switch, and LED for standalone operation
  • ROHS and REACH compliant
  • Module is ETSI compliant and FCC/IC certified
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