Semiconductor Research Corporation and researchers from Stanford University have developed a novel combination of elements that yields a unique nanostructure material for packaging. This advance should allow longer life for semiconductor devices while costing less than current state-of-the-art materials. For semiconductors, the improvement will come in the form of packaging for devices. Presently, manufacturers must rely on tiny pins or thick solder to bond sections of the semiconductor in order for the device to perform. However, current solder materials tend to degrade and fail due to heat and mechanical stress. In order to continue the scaling of integrated circuits, SRC and Stanford have researched materials that provide a high thermal connectivity, comparable to copper, with the flexible compliance of foam. The answer has been created through a nanostructured thermal tape that conducts heat like a metal while allowing the neighboring materials to expand and contract with temperature changes (metals are too stiff to allow this). This ability to reduce chip temperatures while remaining compliant is a key breakthrough for electronic packaging. In addressing the challenges of miniaturization, the first line of defense for hot spots is the interface material. Incorporating nearly two decades of advanced research and simulations for problems at the packaging level, much of it funded by SRC, the Stanford team ultimately arrived at their unique combination of binder materials surrounding carbon nanotubes. This innovation is expected to facilitate the highest thermal conduction and the most desirable level of elasticity of any known packaging solutions. For more information please visit: http://microheat.stanford.edu/publications/A119.pdf
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