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Embedded and Microcontrollers
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Embedded and Microcontrollers
Embedded Forum 远离CE战场 TI整合DSP打高阶嵌入式市场
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  • Replies 0 replies
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  • 德州仪器
  • 嵌入式
  • embedded
  • dsp
  • ti
Related

远离CE战场 TI整合DSP打高阶嵌入式市场

laidandan
laidandan over 14 years ago

        德州仪器(TI)回避消费性电子这片过度竞争的市场,锁定一般工业性质的高阶嵌入式应用,欲以安谋国际(ARM)Cortex-A8单核心整合数字信号处理器(DSP)的策略,吸引需要更高阶算法的客源。
    

        德州仪器现场应用工程协理杜王平福表示,德州仪器整合DSP于Cortex-A8单核心芯片中,欲藉算法提升效能,抢攻一般工业性质的高阶嵌入式应用。
        德州仪器现场应用工程(FAE)协理杜王平福表示,新的Integra芯片架构以频率达1.5GHz的Cortex-A8单核心为基础,并在架构中整合数字信号处理器(DSP),整体而言,可减少讯号印刷电路板(PCB)上的组件、缩小使用空间以降低原料花费,并降低功耗。
    
        由于DSP具备浮点和定点运算能力,可支持进阶算法和实时(Real-time)演算,如快速傅立叶变换(FFT)和数字滤波器,适合超音波、示波器等应用。此外,可节省算法运行时间,腾出额外空间扩充其他功能。杜王平福也透露,下一波产线将导入现场可编程门阵列(FPGA)作为加速器,进一步提升讯号处理效能。
    
        虽然在平板计算机、智能型手机引领下,消费性电子大有可为,且采用ARM核心的厂商更是大有人在,如三星(Samsung)即是不容小觑的对手,但是德州仪器采取不同思考模式,选择避开这块兵家必争之地。杜王平福指出,德州仪器芯片足以支持可携式产品应用,但消费性电子市场瞬息万变,且对于整合更多功能的芯片而言,降价空间受局限,加上周边耗电大,十分不利这场激烈的厮杀,因此藉诉求较长的产品周期,并锁定一般工业性质的高阶嵌入式应用作为布局策略。
    
        为避免芯片效能受限于传输瓶颈,Integra同时也着重周边总线效能,共支持1.6GHzDDR2/DDR3、5Gbit/s的第二代PCIe通道、序列式先进附加接口(SATA)2.0,以及1Gbit/s的以太网络媒体访问控制(MAC)。
    
        此外,杜王平福补充,德州仪器标榜软件开发工具包,透过验证平台,并随时更新如除错、编译程序、即成化开发环境(CCS)等开发工具,使用者可透过平台彼此交流分享,帮助缩短开发时间。

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