NXP Semiconductors has announced the LPC11C22 and LPC11C24, said to be the industry’s first integrated high-speed CAN Physical Layer transceiver and microcontroller with on-chip CANopen drivers. Offered as a System-in-Package (SIP) solution, the LPC11C22 and LPC11C24 with integrated TJF1051 CAN transceiver combine CAN functionality into a LQFP48 package.
Typically, CAN transceivers can cost as much as or even more than the microcontroller itself. Integrating the CAN transceiver on board increases system reliability and quality, reduces electrical interconnect and compatibility issues, and reduces board space by over 50 percent while adding less than 20 percent to the MCU cost.
The LPC11C22/C24 CAN Physical Layer is compliant with the ISO 11898-2 standard for two-wire balanced signaling and is optimized for sensor applications and is designed for up to 1 Mbit/s High-Speed CAN networks.
These latest additions to the LPC11C00 series of CAN 2.0B-compliant controllers feature Electrostatic Discharge (ESD) protection, improved Electromagnetic Compatibility (EMC) and low power operation-- the transceiver can disengage from the bus when it is not powered up. High ESD handling capability on bus pins is combined with additional fail-safe features such as high DC handling capability on CAN pins, Transmit Data dominant time-out function, undervoltage detection, and thermal protection.
CANopen drivers are provided in on-chip ROM with APIs enabling users to rapidly adopt the LPC11C22/C24 into embedded networking applications based on the CANopen standard. With over 45 DMIPS of performance, the LPC11C22 and LPC11C24 provide message and data handling capability well suited for CAN device nodes.
According to NXP the LPC11C22 and C24 require 40-50 percent smaller code size than 8/16 bit microcontrollers for most common microcontroller tasks.
The LPC11C22 and LPC11C24 will be available worldwide during the first calendar quarter of 2011.
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