What is the best method for spot cleaning CCA's when a component is replaced? Specifically, flux which remains under the components.
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What is the best method for spot cleaning CCA's when a component is replaced? Specifically, flux which remains under the components.
I use 99.9% isopropyl alcohol. MG Chemicals sells it as wipes and as a bottle. I generally use the bottle and Q-tips to clean the area. It works great and I can't think of any reason this is a "risk." I've been doing it for years. The bottle part number I use is "824-1L" and the wipes are "1610-100DSP" (the wipes are from tech spray). I generally use no clean solder and a flux pen (catalog #951 from Kester). If I want to clear a whole board at once, I use the MG spray bottle (PN 824-500ml), coat the board and go after it with a toothbrush. I only did this when I used flux solder and I find that now I rarely do this. When I spray a whole board, I use a toothbrush to clean it dislodge the flux, then I coat it a couple of times with the spray and let it roll off only a paper towel.
IPA is not doing a satisfactory job in removing the flux from underneath the components, but if we flood the area with IPA or Toluene, and vacuum it up with a suction hose, we get a much cleaner board. Do you see any issues with this method? I'm concerned that using a vacuum would create an ESD issue.