TI today introduced two new power management ICs for Point of Load (PoL) designs. The TPS82671 is said to be the industry’s smallest integrated plug-in power solution at 6.7 mm2, providing 90 mA/mm2. It combines external components in a MicroSiP package with a 1-mm height for 600-mA portable electronics, such as smart phones.
The device operates at 17-µA quiescent current and according to TI achieves power efficiency of greater than 90% from an input voltage of 2.3 to 4.8 V. A PWM frequency dithering feature reduces noise and improves performance in radio frequency-sensitive designs.
The TPS84620 is a 6-A, 14.5-V device with a power density of greater than 800 W/in3 with, TI claims, up to 95% efficiency and 30% better thermal dissipation than competitors. The integrated step-down solution combines the inductor and passives onto one device, and requires only three external components, for a complete solution in a less than 200 mm2 footprint. The part support high-power telecom infrastructure and industrial systems that use DSPs and FPGAs.
