element14 Community
element14 Community
    Register Log In
  • Site
  • Search
  • Log In Register
  • About Us
  • Community Hub
    Community Hub
    • What's New on element14
    • Feedback and Support
    • Benefits of Membership
    • Personal Blogs
    • Members Area
    • Achievement Levels
  • Learn
    Learn
    • Ask an Expert
    • eBooks
    • element14 presents
    • Learning Center
    • Tech Spotlight
    • STEM Academy
    • Webinars, Training and Events
    • Learning Groups
  • Technologies
    Technologies
    • 3D Printing
    • FPGA
    • Industrial Automation
    • Internet of Things
    • Power & Energy
    • Sensors
    • Technology Groups
  • Challenges & Projects
    Challenges & Projects
    • Design Challenges
    • element14 presents Projects
    • Project14
    • Arduino Projects
    • Raspberry Pi Projects
    • Project Groups
  • Products
    Products
    • Arduino
    • Avnet Boards Community
    • Dev Tools
    • Manufacturers
    • Multicomp Pro
    • Product Groups
    • Raspberry Pi
    • RoadTests & Reviews
  • Store
    Store
    • Visit Your Store
    • Choose another store...
      • Europe
      •  Austria (German)
      •  Belgium (Dutch, French)
      •  Bulgaria (Bulgarian)
      •  Czech Republic (Czech)
      •  Denmark (Danish)
      •  Estonia (Estonian)
      •  Finland (Finnish)
      •  France (French)
      •  Germany (German)
      •  Hungary (Hungarian)
      •  Ireland
      •  Israel
      •  Italy (Italian)
      •  Latvia (Latvian)
      •  
      •  Lithuania (Lithuanian)
      •  Netherlands (Dutch)
      •  Norway (Norwegian)
      •  Poland (Polish)
      •  Portugal (Portuguese)
      •  Romania (Romanian)
      •  Russia (Russian)
      •  Slovakia (Slovak)
      •  Slovenia (Slovenian)
      •  Spain (Spanish)
      •  Sweden (Swedish)
      •  Switzerland(German, French)
      •  Turkey (Turkish)
      •  United Kingdom
      • Asia Pacific
      •  Australia
      •  China
      •  Hong Kong
      •  India
      •  Korea (Korean)
      •  Malaysia
      •  New Zealand
      •  Philippines
      •  Singapore
      •  Taiwan
      •  Thailand (Thai)
      • Americas
      •  Brazil (Portuguese)
      •  Canada
      •  Mexico (Spanish)
      •  United States
      Can't find the country/region you're looking for? Visit our export site or find a local distributor.
  • Translate
  • Profile
  • Settings
Power & Energy
  • Technologies
  • More
Power & Energy
Forum Fujitsu develops copper-internal-electrode-based capacitors
  • Blog
  • Forum
  • Quiz
  • Documents
  • Polls
  • Events
  • Mentions
  • Sub-Groups
  • Tags
  • More
  • Cancel
  • New
Actions
  • Share
  • More
  • Cancel
Forum Thread Details
  • Replies 0 replies
  • Subscribers 285 subscribers
  • Views 147 views
  • Users 0 members are here
  • capacitor
  • research
  • fujitsu
  • power_management
  • high_speed
Related

Fujitsu develops copper-internal-electrode-based capacitors

ZeroSizeObject
ZeroSizeObject over 14 years ago
image
Fujitsu Laboratories announced the development of a process technology to produce capacitors for high-speed LSI chips, which, as a world's first, employs copper for internal electrodes. The use of copper for internal electrodes lowers the impedance of the capacitor itself, and by mounting the capacitor directly below the LSI chip, impedance from the circuits can also be reduced, resulting in increase of current-flow efficiency by 10 times compared to previously available technology. The new technology is expected to enable the next generation of high-speed computers to operate at even higher speeds. As LSI chips continue to achieve higher speeds and higher integration densities, and with many of a chip's elements all operating simultaneously, much of the current used by the chip is consumed in bursts. This can lower voltages, which may impact proper operation. In those instances in which much current is consumed, it is desirable to mount a capacitor near the LSI chip to instantly supplement the current. Conventionally, ceramic-chip condensers being used as power-supply capacitors have been mounted on the surface or rear of the circuit board or LSI chip package, supplying current to the LSI chip through the circuit wires. This method results in a relatively long electrical pathway between the capacitor and LSI chip, which raises impedance and would potentially create instabilities in future high-speed PC’s. In addition, because nickel, which has comparatively high resistance, has conventionally been used for the internal electrodes in the capacitor, the impedance of the capacitor itself has been high, limiting the speed of the power-supply current. Fujitsu Laboratories developed a basic manufacturing method for capacitors that can provide high-speed, stable supply of current to an LSI chip. Employing copper for the internal electrodes to lower the impedance of the capacitor itself reduces the length of the circuits between the capacitor and the LSI chip, making it is possible to limit impedance of the power-supply line. These factors together result in a power supply that is 10 times as efficient for operationally stable high-speed LSI chips, a development that is expected to contribute to higher computer speeds.

Zero
  • Sign in to reply
  • Cancel
element14 Community

element14 is the first online community specifically for engineers. Connect with your peers and get expert answers to your questions.

  • Members
  • Learn
  • Technologies
  • Challenges & Projects
  • Products
  • Store
  • About Us
  • Feedback & Support
  • FAQs
  • Terms of Use
  • Privacy Policy
  • Legal and Copyright Notices
  • Sitemap
  • Cookies

An Avnet Company © 2025 Premier Farnell Limited. All Rights Reserved.

Premier Farnell Ltd, registered in England and Wales (no 00876412), registered office: Farnell House, Forge Lane, Leeds LS12 2NE.

ICP 备案号 10220084.

Follow element14

  • X
  • Facebook
  • linkedin
  • YouTube