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Documents News Release: Combo SIM/Micro SD socket for high vibration environments
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  • Author Author: doctorcdf
  • Date Created: 25 Sep 2012 1:46 PM Date Created
  • Last Updated Last Updated: 25 Sep 2012 1:47 PM
  • Views 480 views
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News Release: Combo SIM/Micro SD socket for high vibration environments

Leading connector manufacturer Global Connector Technology is launching a new combination Micro-SD and SIM connector.

Engineers designing for high vibration environments will value the MES3055-02-290-01-AMES3055-02-290-01-A hinged connector which allows full retention of both the SIM and µSD cards in demanding handheld and mobile applications.
The connector also allows engineers to design more reliably for dust-laden or damp environments as the cards can be sealed inside the final product not allowing ingress of moisture or dust. The MES3055-02-290-01-AMES3055-02-290-01-A is fully qualified to relevant MIL and EIA standards and will withstand a 50G shock without loss of electrical connectivity.
Available in tape-and-reel packaging for volume manufacturing the MES3055-02-290-01-AMES3055-02-290-01-A offers excellent coplanarity of +/-0.05mm while withstanding IR reflow at temperatures up to 260°C.

Visit http://www.globalconnectortechnology.com/connector/MES3055-sim-card-connector.aspx for more information.

 

Newark customers (Americas) click here: MES3055 Combo SIM and µSD card connectorMES3055 Combo SIM and µSD card connector

Farnell customers (EU and APAC) click here MES 3055 Combo SIM and µSD card connectorMES 3055 Combo SIM and µSD card connector

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