I think the large copper plane is also taking up the heat from the soldering iron. Just a small copper pad and a higher temperature may help. I would have tried scraping off the nickle from the wire before soldering. But the thermistor wires are too thin for that.
I think the large copper plane is also taking up the heat from the soldering iron. Just a small copper pad and a higher temperature may help. I would have tried scraping off the nickle from the wire before soldering. But the thermistor wires are too thin for that.
In scottiebabe's case, where a large copper plain is required, a preheater can do wonders. When you use that, say to 120° C, the soldering iron has approx. 100° less to bridge.
A preheater makes life easier in general. And the value increases when you deal with large copper planes and lead-free. If the PCB is traditional, thin trace only, then a preheater doesn't add. Other situations - be it with iron or air gun - it's a step up in solder comfort.
Additional win: it reduces the time you have to heat up components. For hybrid ICs that have an internal PCB (like the TI LM5XXX GaN FET), this can be the difference between success and failure. Hot-airing these too long will desolder internal connections in that type of IC.
