Broadband components are an essential part of many high-speed test applications. This presentation will discuss a variety of high-speed component types (bias tees, DC blocks, amplifiers, power dividers, etc.), their key performance parameters, as well as their applications in serial data and RF testing. Specific application examples will be shown as well as key test challenges and how to address them.Presenter: Kipp Schoen, Product Marketing Manager, Tektronix
Kipp earned a PhD in Electrical Engineering from Purdue University in 1997, an international MBA from the University of Kent at Canterbury, England in 1991, and a BS in Electrical Engineering from Kansas State University in 1989. Kipp joined Picosecond/Tektronix in 2001 and has worked in technical marketing since 1995. Throughout his career Kipp has worked in a number of engineering and marketing positions at Hewlett-Packard, Agilent, and the Johns Hopkins Applied Physics Lab. Kipp's professional roles have included product management, strategic marketing, and engineering design. Recently Kipp has specialized in the area of high-speed serial data testing, including SERDES and multi-channel optical module testing. Specific measurement topics of interest include signal characterization, stressed signal pattern generation, and bit error analysis.