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An in-depth look at how developments in automotive connectivity are driving the need for micro connector solutions, and how to leverage them in your applications.


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Developments in automotive technologies are enabling smarter, more feature rich in-vehicle applications, which in turn vastly improve vehicle performance. This transformation is driving data requirements, creating a need for connectivity solutions that can handle more data at higher speeds than ever before.




Hosted by element14, with a 40-minute presentation from Brad Eissler, Business Development Manager, Consumer and Commercial, Molex, this webinar will explore:


  • How key trends are driving increased modularity and the need for more FPC, wire-to-board and board-to-board connectors
  • The applications micro connectors are being used in, and their common connection points
  • An overview of Molex micro connector solutions and their advantages for the automotive market




The Presenter




Brad Eissler, Business Development Manager, Consumer and Commercial, Molex


Brad Eissler is a Business Development Manager responsible for the development and promotion of Molex Consumer and Commercial product lines. He joined Molex in 2002 as an inside sales representative, and in 2004, he relocated to Japan to support US customers utilising Japanese products. During his career at Molex he has relocated between the US and Japan to hold marketing, product management and account management roles working on the development of next generation mobile and consumer connector solutions. Brad has served as a product manager for the Antenna business unit, and as a group product manager for the High Speed I/O product line. He is a graduate of Purdue University and holds a Bachelor of Science degree.