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We Are Giving Away 5 Ultra Low-Profile Innovation Kits for Asking the Best Questions!  Register for a Chance to Win!

This webinar discusses the benefits of using a single Ultra Low-Profile capacitor to replace large banks of SMT capacitors. Learn how to reduce board space, weight, and reduce component count to improve reliability.

 

Traditional methods of low-profile bulk storage consume valuable PCB space.  The ULP capacitor is designed specifically for applications requiring bulk capacitance and the lowest board profiles, type ULP offers considerably higher energy density than arrays of surface mount or axial capacitors. ULP technology allows the circuit designer to use a single component that saves space, weight, and cost while improving reliability.

 

What you will learn by attending:

 

  • You will learn how to make your bulk storage design more reliable using Cornell Dubilier’s ULP capacitor.
  • How to achieve increased reliability by using one component vs many.  With energy density exceeding 0.4 J/cc, a single ULP capacitor provides much greater bulk storage in a smaller footprint than a bank of low-profile SMT capacitors.  This improves circuit reliability while achieving higher capacitance on the board.
  • Gain an understanding of the design flexibility with the flat ribbon-lead style terminations that allow the component to be designed off-board.

 

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What you will learn by attending:

 

  • You will learn how to make your bulk storage design more reliable using Cornell Dubilier’s ULP capacitor.
  • How to achieve increased reliability by using one component vs many.  With energy density exceeding 0.4 J/cc, a single ULP capacitor provides much greater bulk storage in a smaller footprint than a bank of low-profile SMT capacitors.  This improves circuit reliability while achieving higher capacitance on the board.
  • Gain an understanding of the design flexibility with the flat ribbon-lead style terminations that allow the component to be designed off-board.

 

 

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The Presenter:

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Mike McGeachie, Field Application Engineer at Cornell Dubilier Electronics

Mike is a Navy veteran and holds a BSEE from Clemson University. Prior to moving into Field Application Engineering for Cornell Dubilier, Mike spent 28 years in aluminum electrolytic design engineering and was instrumental in the design of many of our flat form factor products, including the ULP