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Heatsink usage

Andrew J

Specifically, this heatsink: Fischer Elektronik LA6/150 12VFischer Elektronik LA6/150 12V.  I'm trying to work out how that might be used so I'm putting it out there to see if anyone has used something like it or have ideas.  From what I can tell, it 'seems' to be used with a removable bottom plate for 'flat' semiconductors but I'm thinking that something like, say, a TO220 package could be attached to the side with a self-tapper.  A bit like they show with their LAM series heatsinks (PDF, sorry for the non-Farnell link!): here they show them with transistors 'clipped' to the side on the K version so I'd assume that on the non-K version, one would just screw it on.  What think you lot?

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  • For use with a TO220 package device, the LA6/150 12V heatsink would be an overkill and expensive too. From what I have seen, this type heatsinks are used on SMD ICs like processors or FPGAs. Basically on devices that can get quite hot. If you have multiple TO220 packages for example incase of inverter circuits or any other power electronics circuits, then I think it's feasible to use and yes drilling and hole and screwing the TO220 in the LA6/150 is fine. I have used simple aluminum from the waste material of frames for french windows in my house. They work fine as a heat sink.

  • in reply to rsjawale24

    I'm no thermodynamic expert, but agree with your advice. Unless a device is being driven to its max limits, the important thing is to get a thermally conductive piece of metal on a TO220 into a puff of fresh airflow, in an enclosure that an air intake path and an exhaust path (to minimize the enclosure ambient temperature) .   

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  • in reply to rsjawale24

    I'm no thermodynamic expert, but agree with your advice. Unless a device is being driven to its max limits, the important thing is to get a thermally conductive piece of metal on a TO220 into a puff of fresh airflow, in an enclosure that an air intake path and an exhaust path (to minimize the enclosure ambient temperature) .   

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