It is all about temperature perspective. From functional perspective, they are identical.
If I may, how would they differ internally from the temperature point of view? What would be the difference in the process used for manufacturing the two?
I was going to ask exactly the same. Also, who would need to put a development board to -35ºC? I Can understand that Xilinx wants to build variants of their designs for extreme temperatures but why is that useful in a development kit?
Ultra96 is not a development kit only. It is a 96boards standard based compatible single board computer module that happens to be useful as development kit. We use it in production systems.
Thank you for the information. I understand that it's an 96boards standard SBC and given the form factor it is provided in, it's more likely (as intended) to be used in a production setting than in a prototyping environment. I am curious to know what core difference in the component selection and manufacturing process constitutes the temperature tolerance difference of the two variants.
This is the consumer grade BOM: www.avnet.com/.../Ultra96-V2 Rev1.04 C-grade BOM.pdf
and the industrial grade one: https://www.avnet.com/wps/wcm/connect/onesite/370e6ff5-0482-4137-81e8-b7d8f2628d79/Ultra96-V2+Rev1.02+I-grade+BOM.pdf?MOD=AJPERES&CACHEID=ROOTWORKSPACE.Z18_NA5A1I41L0ICD0ABNDMDDG0000-370e6ff5-0482-4137-81e8-b7d8f2628d79-nDn.bBw
The Xilinx device is different.
Consumer: Xilinx XCZU3EG-1SBVA484E
Industrial: Xilinx XCZU3EG-1SBVA484I